JPS58104169A - Electroless plating method - Google Patents

Electroless plating method

Info

Publication number
JPS58104169A
JPS58104169A JP20253381A JP20253381A JPS58104169A JP S58104169 A JPS58104169 A JP S58104169A JP 20253381 A JP20253381 A JP 20253381A JP 20253381 A JP20253381 A JP 20253381A JP S58104169 A JPS58104169 A JP S58104169A
Authority
JP
Japan
Prior art keywords
metallic
plating
salt
metal
reducing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20253381A
Other languages
Japanese (ja)
Inventor
Masaaki Umehara
正彬 梅原
Hideaki Oba
大庭 秀章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP20253381A priority Critical patent/JPS58104169A/en
Publication of JPS58104169A publication Critical patent/JPS58104169A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Abstract

PURPOSE:To form metallic plating having fine appearance with a small amount of a plating soln. by coating a metal or plastics with the plating soln. contg. a water soluble binder, a metallic salt or a metallic complex salt, and a reducing agent and by carrying out heating. CONSTITUTION:A plating soln. contg. a water soluble binder, a metallic salt or a metallic complex salt, and a reducing agent is prepared. Starch, water soluble cellulose, tannin or the like is used as the water soluble binder. The metallic salt or the metallic complex salt is required to deposit metallic ions of Ni, Au, Ag, Co, Sn or the like by the action of the reducing agent. Formalin, tartaric acid, reducing sugar or the like is used as the reducing agent. The metallic ion concn. of the plating soln. is adjusted to 0.01-10mol/l. A metal or plastics is coated with the plating soln. and heated at 50-150 deg.C for 2-30min.

Description

【発明の詳細な説明】 本発明は金属tたはプラスチックに適用される新規な無
電解メッキ方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a novel electroless plating method applied to metals or plastics.

無電解メッキは化学反応を利用したメッキ方法で、電気
メッキのように電流を流す必要がカいので、電流の不良
導体であるプラスチックにも直接メッキができるため最
近になって実用化が促進された。しかしながら、これま
で行なわれている無電解メッキはメッキ浴を大量に必要
とじt要保存性もよくない。まえ、使用後メッキ浴を廃
水処理しなければならないので多くの費用を要するとい
う問題がある。
Electroless plating is a plating method that uses a chemical reaction, and unlike electroplating, it does not require the flow of current, so it has recently become more practical because it can directly plate plastic, which is a poor current conductor. Ta. However, the electroless plating that has been practiced so far requires a large amount of plating bath and has poor storage stability. First, there is a problem in that the plating bath must be treated as waste water after use, which requires a lot of cost.

本発明は上記問題Kliみてなされたもので、安定で少
量のメッキ液で外観の美しい金属メッキを施すことを目
的とする。
The present invention was made in view of the above-mentioned problem, and it is an object of the present invention to perform metal plating with a stable and beautiful appearance using a small amount of plating solution.

上記目的を達成するために1本発明は金属塩または金属
錯塩および還元剤を含有する液に水−性バインダーを添
加し九メッキ液を使用ししかも該メッキ液を金属ま九は
プラスチックにコーティング方式によシ適用し加熱する
ことからなる無電解メッキ方法を提供することである。
In order to achieve the above object, the present invention uses a plating solution in which an aqueous binder is added to a solution containing a metal salt or a metal complex salt and a reducing agent, and the plating solution is coated on metal or plastic. An object of the present invention is to provide an electroless plating method comprising applying and heating.

ここで本発明でいう「無電解メッキ方法」とは、従来の
ようにメッキ浴に被メッキ材を浸漬してメッキを施す方
法とは異なり、メッキ液を複メッキ材にコーティングに
よシ適用し金属メッキを施す方法會意味する。
Here, the "electroless plating method" as used in the present invention is different from the conventional method of plating by dipping the material to be plated in a plating bath. A method of applying metal plating.

上述したように1本発明は水溶性パインダーを使用する
ことを特徴とするが、このバインダーの添加効果として
はメッキ浴の湯度増大、メッキ浴の常温での還元反応の
遅延、被メッキ材へのコーティング効率の増大などが考
えられる。
As mentioned above, the present invention is characterized by the use of a water-soluble binder, and the effects of adding this binder include increasing the hot water temperature of the plating bath, delaying the reduction reaction of the plating bath at room temperature, and reducing the damage to the material to be plated. Possible reasons include an increase in coating efficiency.

また、メッキ液中の金属析出反応が均一になる結果、外
観の美しいメッキが得られさらにメッキ液の常温での還
元反応が遅くなる結果メッキ液が安定になる。
Furthermore, as the metal precipitation reaction in the plating solution becomes uniform, plating with a beautiful appearance can be obtained, and the reduction reaction of the plating solution at room temperature is slowed down, so that the plating solution becomes stable.

次忙、本発明におけるメッキ液を構成する主要成分につ
いて説明する。水溶性、?インダーとしては、殿粉、水
溶性セルロース、タンニン、アルギン酸、アルギン酸ソ
ーダ、アラビアゴム。
Next, the main components constituting the plating solution in the present invention will be explained. Water soluble,? Inders include starch, water-soluble cellulose, tannin, alginic acid, sodium alginate, and gum arabic.

ポリビニルアルコール、ポリエチレンオキサイド、ポリ
アクリル酸ソーダ、ポリアクリルアンド、ポリビニルピ
ロリド7、#l水マレイン酸、アクリル酸、フタル酸、
ゼラチンなどまたはそれらの組合せを用いることができ
る。金属塩まニッケル、金、銀、コバルト、スズ、鉛、
亜鉛などの金属イオンを析出するものであり、従来の無
電解メッキのメッキ浴に使用されているものであればど
れで4よく、例えば硝酸銀、シアン化銀カリウム、次亜
燐Je@ニッケル、シアン化金カリウム、銀アンミン錯
体、銀シアン錨体、金塩または金シアン錯体などを使用
することができる。還元剤としては例えばホルマリン、
酒石酸、酒石酸塩、還元糖、無水亜燐酸塩、次亜燐酸塩
、水素化硼素ナトリウム、ジメチルアミンボラン、ヒド
ロ中ノンなどを使用できる。上記各成分の他イ、緩衝剤
例えばギ酸塩、酢酸塩などやその他の添加剤を用いるこ
とができる。
Polyvinyl alcohol, polyethylene oxide, polysodium acrylate, polyacrylic acid, polyvinylpyrrolid 7, #l hydromaleic acid, acrylic acid, phthalic acid,
Gelatin, etc. or combinations thereof can be used. Metal salts nickel, gold, silver, cobalt, tin, lead,
It precipitates metal ions such as zinc, and can be any of those used in conventional electroless plating baths, such as silver nitrate, potassium silver cyanide, hypophosphorous Je@nickel, cyanide, etc. Potassium gold chloride, silver ammine complex, silver cyanide anchor, gold salt or gold cyanide complex, etc. can be used. Examples of reducing agents include formalin,
Tartaric acid, tartrate, reducing sugar, anhydrous phosphite, hypophosphite, sodium borohydride, dimethylamine borane, hydrocarbon, and the like can be used. In addition to the above-mentioned components, buffers such as formates, acetates, and other additives can be used.

なお、被メツ=1材として金属を用いる場合は、還元剤
を必ずしも必要としない、tた1本発明におけるメッキ
液中の金属イオン濃度はα01〜10モル/lの範囲に
調整するのが適当である。
Note that when a metal is used as the material to be plated, a reducing agent is not necessarily required, and it is appropriate to adjust the metal ion concentration in the plating solution in the present invention to a range of α01 to 10 mol/l. It is.

上述したことから理解されるようK、本発明によれば上
記金属塩ま友は金属錯塩の種−蚕室化する。おにより=
ッヶ2、金、銀、3バ2.。
As can be understood from the above, according to the present invention, the metal salt is converted into a metal complex salt. Thanks =
2, gold, silver, 3 ba 2. .

スズ、給、亜鉛などの目的とする金属メッキを金属また
はプラスチックに施すことができる。
Metals or plastics can be plated with desired metals such as tin, carbon, zinc, etc.

次畝本発明の無電解7ツキ方法を一般的に説明する。ま
ず、従来の無電解メッキ方法と同一にして被メッキ材に
前処理を行なう。金属の場合、前処理は水洗、脱脂程度
でよいが、プラスチックの場合、水洗1M8旨、−ツチ
ング、感受性化処理、活性化処理などが必要である。次
いで、前処理した被メッキ材にメッキ液を一般的に行な
われている塗布方法に↓シコーティングする。塗布方法
として扛ブラシ塗り、ローラー領り、戚し塗り1回転車
シ、スプレー塗りなどを用いることができる。塗膜の厚
さは(11μ〜300μの範囲が適当である。次いで、
塗膜を加熱する。加熱Fiso〜150℃の温度で2〜
30分間行カリのが適当である。
Next ridge The electroless 7 plying method of the present invention will be generally described. First, the material to be plated is pretreated in the same manner as in the conventional electroless plating method. In the case of metals, the pretreatment may be as simple as washing with water and degreasing, but in the case of plastics, washing with 1M8 water, -touching, sensitization treatment, activation treatment, etc. are required. Next, the pretreated material to be plated is coated with a plating solution using a commonly used coating method. As an application method, brush application, roller application, one-turn wheel application, spray application, etc. can be used. The thickness of the coating film (appropriately ranges from 11μ to 300μ).
Heat the coating. Heating Fiso~2~ at a temperature of 150℃
A period of 30 minutes is appropriate.

以下、実施例を掲げて本発明を説明するがこれに限爺さ
れるものではない。
The present invention will be explained below with reference to Examples, but the present invention is not limited thereto.

実施例 1 ポリビニルアルコール(7優水溶液)     50g
ホルムアミド           5−硝酸銀   
   15.9 アンモニア水           3〇−50優ブド
ウ糖液        2〇−上記成分よりなる液を前
処理ずみのアクリル板にスピンコーティングにより3μ
の厚さで塗布した後%80℃で5分間加熱することによ
り外観が美しい銀メッキ膜を得た。 □ 実施例 2 ポリビニルアルコール(7チ水溶液)   、−10(
1次亜燐酸ニッケル         279硼  敵
              51i硫敏アンモニウム
          511酢酸ナトリウム     
      5g水                
      20wj上記成分エリなる液を前処理ずみ
のアクリル板にスピンコーティングにより3μの厚さで
塗布した後、80℃で5分間加熱し水洗して外観が−J
Lいニッケルメッキ膜を得た。
Example 1 Polyvinyl alcohol (7 excellent aqueous solution) 50g
Formamide 5-silver nitrate
15.9 Ammonia water 30-50 dextrose solution 20-A solution consisting of the above components was spin-coated onto a pretreated acrylic plate to a thickness of 3 μm.
A silver plating film with a beautiful appearance was obtained by coating the silver plating film to a thickness of 20% and heating it at 80° C. for 5 minutes. □ Example 2 Polyvinyl alcohol (7T aqueous solution), -10(
Nickel hypophosphite 279 Enemy 51i Ammonium sulfate 511 Sodium acetate
5g water
20wj After applying the liquid with the above ingredients to a thickness of 3μ by spin coating on a pretreated acrylic plate, heating it at 80℃ for 5 minutes and washing with water, the appearance is -J.
A thick nickel plating film was obtained.

実施例 6 下記の成分よりなる液を用いる以外にFi実施例1と同
様にして外観が美しい鋼メッキ膜を得た。
Example 6 A steel plating film with a beautiful appearance was obtained in the same manner as in Fi Example 1 except that a liquid consisting of the following components was used.

ポリビニルアルコール(7−水@敵)     100
111′1::、、・i 億酸銅      10g EDTム−4Na場              50
.9ホルマリン           1011水酸化
ナトリウム         109実施例 4 ポリビニルアルコール(7優水溶液)     20(
[’硫酸ニッケル           25g次亜燐
酸ソーダ          25Iピロリン酸ンーダ
          50I上記成分よりなる液を前処
理した鉄板に塗布した後、120℃で5分間加熱して外
観が美しいニッケル膜を得た。
Polyvinyl alcohol (7-water @ enemy) 100
111′1::,,・i Copper chloride 10g EDT Mu-4Na field 50
.. 9 Formalin 1011 Sodium hydroxide 109 Example 4 Polyvinyl alcohol (7 excellent aqueous solution) 20 (
['Nickel sulfate 25g Sodium hypophosphite 25I Sodium pyrophosphate 50I After applying a solution consisting of the above ingredients to a pretreated iron plate, it was heated at 120°C for 5 minutes to obtain a nickel film with a beautiful appearance.

なお1本発明の方法によシ施した金属メッキの上にさら
に慣用の電気メッキによシ別途メッキを施すこともでき
る。
Furthermore, on top of the metal plating applied by the method of the present invention, it is also possible to separately apply plating by conventional electroplating.

このように、本発明の無電解メッキ方法によれば塗膜を
形成する程度のメッキ液を被メッキ材に塗布すればよい
ので、使用されるメッキ液1′し は大変少量ですむ−し九がって廃水も少なく安価にメッ
キを施すことができる。
As described above, according to the electroless plating method of the present invention, it is only necessary to apply enough plating solution to the material to be plated to form a coating film, so the amount of plating solution used can be very small. Therefore, there is less waste water and plating can be performed at low cost.

Claims (1)

【特許請求の範囲】 金属またはプラスチックに水溶性バインダー。 金属塩を九は金属錯塩および還元剤を含有するメッキ液
をコーティングした後加熱することを特徴とする。無電
解メッキ方法。
[Claims] Water-soluble binder for metal or plastic. The metal salt is coated with a plating solution containing a metal complex salt and a reducing agent and then heated. Electroless plating method.
JP20253381A 1981-12-17 1981-12-17 Electroless plating method Pending JPS58104169A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20253381A JPS58104169A (en) 1981-12-17 1981-12-17 Electroless plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20253381A JPS58104169A (en) 1981-12-17 1981-12-17 Electroless plating method

Publications (1)

Publication Number Publication Date
JPS58104169A true JPS58104169A (en) 1983-06-21

Family

ID=16459068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20253381A Pending JPS58104169A (en) 1981-12-17 1981-12-17 Electroless plating method

Country Status (1)

Country Link
JP (1) JPS58104169A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149566A (en) * 1988-09-27 1992-09-22 Courtaulds Coatings Limited Metal plating process
CN104328392A (en) * 2014-10-30 2015-02-04 广东电网有限责任公司电力科学研究院 Coating type chemical plating method based on low-temperature plating liquid

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149566A (en) * 1988-09-27 1992-09-22 Courtaulds Coatings Limited Metal plating process
CN104328392A (en) * 2014-10-30 2015-02-04 广东电网有限责任公司电力科学研究院 Coating type chemical plating method based on low-temperature plating liquid

Similar Documents

Publication Publication Date Title
US2369620A (en) Method of coating cupreous metal with tin
US3033703A (en) Electroless plating of copper
JP2015509146A (en) Electroless nickel plating bath
US4181760A (en) Method for rendering non-platable surfaces platable
GB1176124A (en) A Method of Metallizing a Polymer Surface.
US3993801A (en) Catalytic developer
US3553085A (en) Method of preparing surfaces of plastic for electro-deposition
CN102002689B (en) Method for preparing silica and alumina sol type activator used for activating nonmetal materials
US2976181A (en) Method of gold plating by chemical reduction
GB1307927A (en) Electroless plating
GB1006238A (en) Electrical components
US2976180A (en) Method of silver plating by chemical reduction
JPH0613753B2 (en) Method for producing solution containing fine metal body used for electroless plating
DK143609B (en) PROCEDURE FOR CATALYTIC SENSITIZATION OF NON-METAL SURFACES FOR SUBSEQUENTLY METAL DEPOSIT
JPH067679A (en) Production of platinum alloy catalyst for phosphoric acid type fuel cell
JPS58104169A (en) Electroless plating method
GB1242995A (en) Electroless nickel plating on a nonconductive substrate
US3841881A (en) Method for electroless deposition of metal using improved colloidal catalyzing solution
US3698939A (en) Method and composition of platinum plating
US4643918A (en) Continuous process for the metal coating of fiberglass
US3274022A (en) Palladium deposition
US4762560A (en) Copper colloid and method of activating insulating surfaces for subsequent electroplating
CN103233212A (en) Method for plating nickel-copper-phosphorus ternary alloy on wood surface
JPH06102830B2 (en) Resin powder granule having noble metal coating and method for producing the same
JP3035676B2 (en) Method for electroless nickel plating on zinc-aluminum alloy, composition for catalytic treatment, composition for activation treatment, and composition for electroless nickel strike plating