JPS58102526A - Pallet jig for sputtering - Google Patents

Abstract

PURPOSE:To improve operationability and efficiently mount or remove silicon wafers by setting a sputter pallet to a jig support and simultaneously pushing upward the plurality of rivets holding silicon wafer with the rivet pushing pins implanted on the jig support in view of forming clearance. CONSTITUTION:A silicon wafer 2 can be removed from the pallet 1 by the following steps. A sputter pallet 1 mounting a silicon wafer 2 is set to a jig support 10 through the support of blocks 13, 13, a silicon wafer 2 is released by simultaneously pushing upward the rivets 5 holding a silicon wafer 2 with the rivet pushing pins 14, the sputter pallet 1 is pulled out of the blocks 13, 13 in the same way after removing the silicon wafer 2 from the pallet 1, thus completing removal of silicon wafer 2.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a sputtering pallet with silicone quench...
This relates to sputtering pallet jigs used for attaching or removing sputtering pallets.

As a sputtering pallet, use the head of a stud to hold down the silicone, sea urchin, etc. on the silicon wafer support surface of the pallet, and then press the back side of the silicone sea urchin to the silicon wafer support surface of the pallet. A sputtering pallet configured to be supported in a vertical position has been developed. Its configuration is shown in FIGS. 1(a), (b) and 2. That is, the silicon wafers 2 are positioned on the vertical silicon wafer support surface 1a of the pallet 1 in correspondence with the bottoms of the plurality of silicon wafers 2 supported by the core. Two positioning pins 3, 3 are attached to do this. In addition, silicon weno
- A plurality of silicone sheets supported on the support surface 1a
A plurality of through holes 4 are opened vertically through the sides of the wafer 2 in correspondence with each other, and each of the through holes 4
Shaft portions 5a of studs 5 each having a head 5b on the silicon wafer support surface 1a side are slidably provided therein. A counterbore 6 is formed around each through hole 4 on the surface opposite to the silicon wafer support surface 1a, and a spring presser 7 disposed within the counterbore 6 is attached to the shaft portion 5a of the stud 5. A coil spring 8 is interposed between the pallet 1 and each spring holder 7, and each coil spring 8 holds the head 5b of the stud 5 against the silicone weno 1- on the support surface side of the silicone weno. is affiliated with. Further, 9 is a counterbore for tweezers and insertion.

Although the drawing shows one silicon wafer being supported, a plurality of silicon wafers can be supported on the pallet with a similar configuration.

To attach a silicon wafer to the sputtering pallet having the above configuration, first, attach the spring holder 7 to the coil spring 8.
is compressed and extruded, and the head 5b of the stud 5 is separated from the silicon weno \- support surface 1a, forming a gap between the two through which the silicon weno 2 can pass. In this state, stand the Silicon Weno-2 vertically and attach it with 50 studs and 5 heads.
Pass through the gap between the two from above b and place the bottom part on the two positioning pins 5 and 3.
Perform positioning. After positioning the silicon sea urchin 2, remove the external force applied to the coil spring 8 and use this spring force to urge the head 5b of the rivet 5 toward the silicon weno support surface side, so that the silicon sea urchin... -2 is brought into close contact with the silicon wafer 1-supporting surface 1a, and the silicon wafer 2 is supported in a vertical position.

On the other hand, when removing the silicon wafer 2 from the pallet 1, the head 5b of the stud 5 is attached to the silicon wafer 2 in the same way.
The silicon wafer 2 is released from being held by the studs 5, and the silicon wafer 2 is removed.

As is clear from the above explanation, when attaching or removing silicone wafers 2 from the pallet 1, the coil springs 8 are compressed and the heads 5b of the rivets 5 that hold each silicone wafer 2 are attached to the silicone wafers. It is necessary to separate the wafer from the supporting surface 1a and form a gap between them through which the silicon wafer 2 can pass.

Therefore, in the present invention, a sputtering pallet is set on a jig stand, and pins for pushing up rivets are installed on the jig stand.
This method attempts to form the gap by simultaneously pushing up multiple studs that hold down the wafer, and improves the operability when attaching or removing the silicon wafer and makes one task more efficient. It is characterized by having K.

An embodiment of the present invention will be described below with reference to the drawings. The configuration of the present invention is shown in FIG. That is, the upper surface of the jig table 10 is configured as a sloped surface 10a with a painted front edge, and the i-rolling shaft 12 is arranged on the sloped surface between the bearings 11.1'1 attached to the front edge of the sloped surface 10a. A groove 15a is supported parallel to the front edge of the sloping surface 10a, and a corner portion of the lower edge of the sputtering pallet is inserted into both ends of the rotating shaft 12, and a line connecting the openings of the two is parallel to the front edge of the sloped surface 10a. Attach each block 13 with a S, 13 grooves 15a, 13a
Insert the corner part of the lower edge of the pallet 1 for sputtering to position it parallel to the front edge of the slope 11i10a, rotate the block 13° 15, and tilt the pallet 1 to the jig stand 10 side for sputtering. Place pallet 1 on rivet 5 and spring presser 7 on bottom 1.
1iK and set it on the slope surface 10a.

On the other hand, on the sloped surface 10a of the jig stand 10, pins 14 for pushing up rivets are set up corresponding to the 6 rivets 5 of the pallet 1 for sputtering set in the core part, and on the rear edge, pins 14 for pushing up the sputtering A pallet holding claw 15 that presses down the upper edge of the pallet 1 is attached.

To attach a silicon wafer to a sputtering pallet using the jig of this embodiment, block the lower edge corner of the balent 1 with the spring retainer 7 of the stud 5 facing the sloped surface 10a of the jig stand 10. 13, the pallet 1 is positioned parallel to the front edge of the slope surface 10a, and the pallet 1 supported between the two blocks 13 and 15 is placed on the jig stand 1.
0 to the inclined surface 10a side and hold its upper edge with a claw 15, and set the pallet 1 on the inclined surface 10a of the jig table 10 with the spring pressers 7 of the studs 5 facing downward. When the pallet 1 is set on the jig stand 10, the spring retainers 7 of the six studs 5 are pushed up by the stud push-up pins 14 set on the sloped surface 10a, and the heads 5b of the studs 5 holding down each silicon wafer 2 are pushed up. At the same time, the silicon weno 2 leaves the silicon weno support surface 1a of the pallet 1, and a gap is formed between them through which the silicon weno 2 can pass. Since the sloped surface 10a of the jig table 10 is downward in the front, the silicon wafer 2 slides on the pallet 1 through the gap, and is positioned by being stopped by the two positioning pins 3. When the setting of the silicon wafers 2 is completed, the claws 15 are removed and the sputtering pallet 1 is raised to the front side, and the heads 5b of the studs 5 that hold each silicon wafer 2 are held down by the coil springs 8 that energize the six studs 5. At the same time, each silicon wafer 2 is drawn toward the silicon wafer support surface 1a side, and each silicon wafer 2 is brought into close contact with the silicon wafer support surface 1a by the six studs 5, and supported in a vertical position on the pallet. Sputtering pallet 1 into two blocks 13.15
The attachment of the silicon wafer 2 is now complete.

In addition, when K removes the silicon wafer 2 from the pallet 1, the sputtering pallet 1 with the silicon wafer 2 attached thereto is similarly supported on the block 13.
0, and simultaneously push up the rivets 5 holding down each silicon wafer 2 with the rivet push-up pins 14 to release the holding of the silicon urchins 2 and remove each silicon wafer 2 from the pallet 1. After that, the sputtering pallet 1 is similarly pulled out from the block 15.13, thereby completing the removal of the silicon wafer 2.

As described above, according to the present invention, pins for pushing up rivets are set up on a jig stand for setting pallets for sputtering in correspondence with the rivets of the pallet, and the rivets of the set pallet are pushed up by the pins for pushing up rivets. Since the silicon wafer is released from being held by the rivets, it is possible to simultaneously push up all the rivets provided on the pallet and release the silicon wafer from being held by the six rivets at the same time.

The operability when attaching or detaching silicon wafers can be improved and one operation can be carried out efficiently. Further, since the silicon wafer is attached and removed after the silicon wafer is released from being held by the rivets, damage to the silicon wafer can be prevented.

According to the invention, silicon wafer attachment;
'It has the effect of mechanizing the removal work and promoting automation of the work.

[Brief explanation of drawings]

Figure 1(a) is a plan view showing the sputtering pallet;
Figure (b) is a side view, Figure 2 is a sectional view showing details of part A of Figure 1 (bl), and Figure 5 is a perspective view showing one embodiment of the present invention. 1... For sputtering Palette 2... Silicone 9)
1-3...Positioning pin 5...Rack 5b...
・Tack head 10...Jig stand 15...Block 14...Tack pushing pin 15...Pallet holding claw Patent applicant NEC Corporation

Claims (1)

[Claims] (1) Positioning pins are planted on the vertical silicon wafer support surface in correspondence with the silicon wafer supported thereon, and a head holding the silicon wafer is placed in a hole opened in the support surface. In a sputtering pallet jig for attaching and removing silicon wafers to and from a sputtering pallet, which is provided with studs biased toward the silicon wafer support surface, the pallet is placed on a jig stand on which the sputtering pallet is set. Attach a block to position and raise/lower it to the jig stand, and place it on the pallet set surface.
A pallet jig for sputtering, characterized in that bins for pushing up studs are erected in correspondence with the studs of the pallet, and pallet holding claws are provided.