JPS58102501A - Resistor - Google Patents
ResistorInfo
- Publication number
- JPS58102501A JPS58102501A JP56200209A JP20020981A JPS58102501A JP S58102501 A JPS58102501 A JP S58102501A JP 56200209 A JP56200209 A JP 56200209A JP 20020981 A JP20020981 A JP 20020981A JP S58102501 A JPS58102501 A JP S58102501A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- layer
- photosensitive resin
- film
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
して、その上に感光性樹脂層、接着層及びカバーフィル
ムを形成せしめ九形威物を用いて不必要・な部分の金属
薄膜抵抗体層及び感光性樹脂層、接着層、カバーフィル
ムを除去して抵抗体を製作すゐことに関するものである
。Detailed Description of the Invention: Then, a photosensitive resin layer, an adhesive layer, and a cover film are formed thereon, and unnecessary portions of the metal thin film resistor layer and photosensitive resin layer are coated using Kugata Imono. This relates to manufacturing a resistor by removing the adhesive layer and cover film.
この発明の目的とするところ社前記形成物に任意のパタ
ーンのホトマスクな重ねて紫外線を照射して温湯処理す
るだけで、高性能で且つ簡便な優れた抵抗体を提供する
ことにある。An object of the present invention is to provide a high-performance, simple, and excellent resistor by simply superimposing a photomask with an arbitrary pattern on the formed product, irradiating it with ultraviolet rays, and treating it with hot water.
従来よシ絶縁基板上に予め形成された金属マスクを用い
て真空中で金属を蒸着又はスパッタリングして抵抗体を
形成したシ、スクリーンマスクを用いて印刷して焼結し
たり、又絶縁基板上全面に＠抗膜をメッキで形成したり
、金属箔を貼り付けて化学的にエツチングして抵抗パタ
ーンを形成することによ膜抵抗体を製作していた。従来
品は貴意性、コスト面を考慮した場合はスクリーン印刷
方式が好ましいが、微細パターン、寸法精度、品質の安
定性に難点があった。逆に微細パターン寸法精度の向上
を計ると全面メッキ又は金属箔を貼シ付けた形成物を化
学エツチングの操・作によりて製作されていた。この方
式は前記形成物上にホトレジストを塗布及び乾燥して、
その上にホトマスクを重ねて露光、現會し忙ホトレジス
トによるパターンを形成した後、化学薬品によって抵抗
体の不要部分の膜を除去するという大変煩雑な操作とエ
ッチング廃液の処理等の問題点が多くらうた〇発明者は
絶縁基板上−金属薄膜抵抗層及び感光性樹脂層等を設け
た形成物を用いることにより、簡便に抵抗体を製造する
ことを発明した。その特徴とするところは絶縁基板上に
抵抗薄膜層を形成して、その上に感光性樹脂層及び接着
層、カバーフィルムを形成せしめ九形成物に任意のホト
マスクを重ねて紫外線を照射する。その後６０℃前後の
温湯で加湿して、カバーフィルムを剥離するととＫより
、絶縁基板上に任意のパターンを形成した抵抗体を簡便
に製作することが出来る。更に露光後のパターンエツチ
ングが温湯に浸すだけで完了するため従来の如く化学薬
品によるエツチング法と異なり、無会害、廃液設備の不
要、及びこれらの諸経費が不要であるしと等多くの利点
がある・以下本発明の具体的な実施例について詳細に述
べるＯ
実施例１
第１図に示す如くポリエステル絶縁基板１上に１０００
人のクロム抵抗薄膜層２を形成し、更にジアゾニウム塩
、オレフィン−ビニルケトン共重合体、ジアゾレジン、
Ｏ−キノンジアジド類を主成分とじ九感光性樹脂等を用
いた感光性樹脂層３を形成し、又その上に接着層４、及
びポリエステルフィルムから成るカバーフィルム５よ）
形成すれた市販の形成物ＫＤＰ：ｙイルム（■きもと製
）を用いた。Conventionally, resistors have been formed by vapor deposition or sputtering of metal in a vacuum using a metal mask previously formed on an insulating substrate; Film resistors were manufactured by plating a resistive film on the entire surface, or by attaching metal foil and chemically etching it to form a resistance pattern. For conventional products, screen printing is preferable in terms of quality and cost, but there are drawbacks to fine patterns, dimensional accuracy, and quality stability. On the other hand, in order to improve the dimensional accuracy of fine patterns, the entire surface is plated or a metal foil is pasted onto the product, which is then manufactured by chemical etching. This method involves coating and drying a photoresist on the formed structure,
After forming a pattern using photoresist by overlaying a photomask on top of it and exposing it to light, the film on unnecessary parts of the resistor is removed using chemicals, which is a very complicated operation, and there are many problems such as processing of etching waste liquid. The inventor of Rauta has invented a method for easily manufacturing a resistor by using a formed product in which a metal thin film resistor layer, a photosensitive resin layer, etc. are provided on an insulating substrate. Its characteristics are that a resistive thin film layer is formed on an insulating substrate, a photosensitive resin layer, an adhesive layer, and a cover film are formed thereon, and an arbitrary photomask is placed over the formed product and ultraviolet rays are irradiated. After that, by humidifying with hot water of about 60° C. and peeling off the cover film, a resistor having an arbitrary pattern formed on an insulating substrate can be easily manufactured. Furthermore, pattern etching after exposure can be completed by simply immersing the pattern in hot water, so unlike conventional etching methods using chemicals, there are many advantages such as no harmful effects, no need for waste liquid equipment, and no need for these various expenses. Example 1 As shown in FIG.
A chromium resistive thin film layer 2 is formed, and diazonium salt, olefin-vinyl ketone copolymer, diazoresin,
A photosensitive resin layer 3 is formed using a photosensitive resin containing O-quinone diazide as a main component, and an adhesive layer 4 is formed thereon, and a cover film 5 consisting of a polyester film)
A commercially available product KDP:y ilm (manufactured by Kimoto Co., Ltd.) was used.
第２図に示した如く前記形成物上にポジフィルムｂを重
ねて密着させ、２ｋＷの高圧水銀灯で３０秒間露光した
。次に６０℃の温湯中に１分間浸した後、第２図Ｃの感
光性樹脂層、接着層、カバーフィルムから成る剥離層を
はがすことにより、第４図の如く所定の可変抵抗器の抵
抗体を製作し九〇得られた抵抗値は外径２６ｗｆＩ！内
径１８■〆で、０、１ ｖｍのパターン幅のジグザグパ
ターンで約ＩＫｆ）の抵抗値を得た。又第５図の如く網
目状パターンで製作することが出来る。As shown in FIG. 2, a positive film b was overlaid on the formed product and brought into close contact with the film, and exposed for 30 seconds using a 2 kW high pressure mercury lamp. Next, after immersing it in hot water at 60°C for 1 minute, the peeling layer consisting of the photosensitive resin layer, adhesive layer, and cover film shown in Fig. 2C is peeled off, and the resistance of the predetermined variable resistor is determined as shown in Fig. 4. The resistance value obtained by manufacturing the body is 26 wfI in outer diameter! A resistance value of approximately IKf) was obtained using a zigzag pattern with an inner diameter of 18 mm and a pattern width of 0 to 1 vm. Also, it can be manufactured in a mesh pattern as shown in FIG.
実施例２
実施例１で製作した同方法で固定抵抗器用抵抗体を製作
した。抵抗薄膜層に１ｏｏｏＸのニッケルークロムを用
い８×８露の形状にジグザグパターンを形成した［６図
の如く抵抗体を製作した。Example 2 A resistor for a fixed resistor was manufactured using the same method as in Example 1. A zigzag pattern was formed in the shape of 8×8 dew using 100X nickel-chromium for the resistive thin film layer [A resistor was manufactured as shown in Figure 6.
得られ圧抵抗値は約１００ＫＯでありた。The piezoresistance value obtained was approximately 100 KO.
１１ｍ例から明らかな如く金属薄膜抵抗層の材料の材質
、成分比も変えるととが可能であり、且つ膜厚も変えら
れるため抵抗値範囲本広く選べる。更に製造過１で全く
無会害であるため、製造設備費が安価である。このよう
ｋして製作せしめた抵抗体は簡便に生産出来る。又仕様
変更への対応も安価で容易である。パターン精度もホト
エツチングであるため高精度であ抄、本発明による抵抗
体は従来品に比較して飛躍的に優れたものである。As is clear from Example 11, it is possible to change the material and component ratio of the metal thin film resistance layer, and the film thickness can also be changed, so a wide range of resistance values can be selected. Furthermore, since there is no overproduction and no harmful effects, the manufacturing equipment cost is low. The resistor produced in this way can be easily produced. It is also inexpensive and easy to adapt to changes in specifications. The pattern accuracy is also high because it is photo-etched, and the resistor according to the present invention is dramatically superior to conventional products.
第１図は金属薄膜抵抗形成物の構造図である。
ｌ・・・絶縁基板、２・・・金属薄膜抵抗層、３・・・
感光性樹脂層、４・・・接着層、５・・・カバーフィル
ム第２図は露光の断面図である。ａ・・・紫外線、ｂ・
・・ポジフィルム、Ｃ・・・感光性樹脂層、接着層、カ
バーフィルムから・成る剥離層、ｄ−・・抵抗層１、ｅ
・−絶縁基板〇
第３図は露光後剥離し九断爾図であるＯＣ・・・剥離層
、ｄ・・・抵抗層、ｅ・・・絶縁基板第４図は可蜜抵抗
器用抵抗体の図である。
１・・・絶縁基板、２・・・抵抗部、３・・・電極部第
５図は綱目構造（シャドーマスク状）を示す抵抗体の図
である。１・・・抵抗部、２・・・網目の孔部第６図は
固定抵抗器用抵抗体を示す図である。
１・・・絶縁基板、２・・・抵抗部、３・・・電極部代
１艮ノｔ（鳥岬ｉイ１＋Ｌジノくイ？〒「＋ １ 図
オ ろ 図
第５図
＝ＩＶＺ 図
７１−４ 図FIG. 1 is a structural diagram of a metal thin film resistor formation. l...Insulating substrate, 2...Metal thin film resistance layer, 3...
Photosensitive resin layer, 4...adhesive layer, 5...cover film FIG. 2 is a sectional view of exposure. a...ultraviolet light, b...
...Positive film, C...Peeling layer consisting of photosensitive resin layer, adhesive layer, cover film, d-...Resistance layer 1, e
・-Insulating substrate 〇 Figure 3 is a cross-sectional view of the peeled off layer after exposure. OC...Peeling layer, d... Resistance layer, e... Insulating substrate It is a diagram. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Resistance part, 3... Electrode part FIG. 5 is a diagram of a resistor showing a mesh structure (shadow mask shape). 1...Resistance portion, 2...Mesh hole FIG. 6 is a diagram showing a resistor for a fixed resistor. 1...Insulating substrate, 2...Resistance part, 3...Electrode part 1 part (Torimisaki i 1+L) -4 Figure
Claims (1)
光性樹脂層、接着層及びカバーフィルムを形成せしめた
構造の形成物を用いて、不必要な部分の金属薄膜抵抗体
層及び感光性樹脂層、接着層、カバーフィルムを除去し
て成ることを特徴とする抵抗体。Using a structure in which a metal thin film resistor layer is formed on an insulating substrate, and a photosensitive resin layer, an adhesive layer, and a cover film are formed thereon, unnecessary parts of the metal thin film resistor layer and A resistor comprising a photosensitive resin layer, an adhesive layer, and a cover film removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56200209A JPS58102501A (en) | 1981-12-14 | 1981-12-14 | Resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56200209A JPS58102501A (en) | 1981-12-14 | 1981-12-14 | Resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58102501A true JPS58102501A (en) | 1983-06-18 |
Family
ID=16420617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56200209A Pending JPS58102501A (en) | 1981-12-14 | 1981-12-14 | Resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58102501A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60198701A (en) * | 1984-03-22 | 1985-10-08 | 東京電音株式会社 | Electric resistor |
-
1981
- 1981-12-14 JP JP56200209A patent/JPS58102501A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60198701A (en) * | 1984-03-22 | 1985-10-08 | 東京電音株式会社 | Electric resistor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0083397B1 (en) | Methods of forming electronic microcircuits | |
| US4119480A (en) | Method of manufacturing thick-film circuit devices | |
| US3423205A (en) | Method of making thin-film circuits | |
| US4328298A (en) | Process for manufacturing lithography masks | |
| JPS5816548B2 (en) | Method for selectively metallizing microelectronic devices | |
| KR920007111A (en) | Limited etching method of substrate | |
| US3240602A (en) | Control apparatus and photomechanical processes for producing such | |
| US3960561A (en) | Method for making electrical lead frame devices | |
| US3877810A (en) | Method for making a photomask | |
| US3615465A (en) | Photoetching of metal-oxide layers | |
| JPS58102501A (en) | Resistor | |
| US3649392A (en) | Thin-film circuit formation | |
| US3986876A (en) | Method for making a mask having a sloped relief | |
| US3240601A (en) | Electroconductive coating patterning | |
| KR0162967B1 (en) | Method of fabricating thin and thick films resistance | |
| JPS54134561A (en) | Pattern forming method | |
| US3951659A (en) | Method for resist coating of a glass substrate | |
| US3540954A (en) | Method for manufacturing multi-layer film circuits | |
| US4223088A (en) | Method of forming defined conductive patterns in a thin gold film | |
| JPS5951157B2 (en) | Manufacturing method of thin film pattern | |
| JPS6267546A (en) | Manufacture of flexible mask | |
| JPS589944B2 (en) | photo mask | |
| JPS633301B2 (en) | ||
| JPS58125825A (en) | Forming method for photo-resist pattern | |
| JPS6273261A (en) | Production of photomask |