JPS58101498A - Method of producing heat sink board with gel heat transfer medium - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides an f! Method V for manufacturing a heat sink having a gel-like heat transfer medium used for cooling electronic components attached thereto
C @ do it.

In recent years, with the rapid progress of integrated circuits and large-scale integrated circuits, the mounting density on printed circuit boards and the actual device f of electronic devices composed of multiple printed boards arranged side by side are becoming higher year by year. ing. As packaging density improves, handling of the heat generated by electronic components becomes a major issue as reliability improves.

Conventionally, in electrical and electronic equipment, multiple prints of electronic components were placed all over the place, and air was forced to blow directly onto the S products using a fan or the like to cool them down. The wind quality method is adopted.

- 10,000, the 3JL environment where the electronic FI station is located is deteriorating from the empty gage to the electricity amount, and from the electricity 14'g1 to the site.

If the above-mentioned air cooling method is adopted in such a dry environment, a single piece of dust in the air can cause damage to parts such as integrated circuits.
It may adhere to the s-minutes and cause a short circuit. Furthermore, when the T/C is used in an environment where corrosive gas exists, an unexpected accident has occurred in which the pin portion of the T/C corrodes due to the corrosive gas Vc1, becomes thinner, and finally disappears.

As a way to solve such problems, research has been conducted into coating agents for parts mounted on printed circuit boards and i-boards, and coating agents with strong environmental Vc have also been developed. However, it is not necessarily the best as it suffers from the drawbacks of Meyoudo, such as the thick and hard coating and the inability to replace parts.

As described above, in electronic devices used on-site or in general hidden air rooms, the direct forced air cooling method in which air is directly applied to the surface of components using a fan or the like is viewed as problematic in terms of reliability.

In order to solve the above-mentioned problems in the direct air cooling system, there is an indirect cooling system. In the indirect cooling method, the printed board is housed in a box made of aluminum or the like, and the box is cooled by blowing air through the box using a fan or the like. However, this indirect cooling method generally has poor cooling efficiency because air with poor thermal conductivity exists inside the box.

Another solution is the Noah/less self-cooling method, which dissipates heat without using a fan. This self-cooling method
It! This method lowers the F degree and dissipates heat from the surface of each component by natural convection, but the heat dissipation area of one component is
The reality is that it is not possible to achieve sufficient heat dissipation, especially for components with large power consumption, and in the self-cooling system, the components essentially become air resistance against the natural temperature, which reduces convection. Another reason for the poor cooling efficiency is that the air flow due to the natural mowing flow does not flow uniformly over the surfaces of each component. Also, since the self-cooling system does not have a fan, strong winds do not blow directly against the parts, but the parts are exposed to the atmosphere.
Since they are in contact with each other, accumulation of dust from the surrounding environment is unavoidable.

A method to solve this problem: The seller first decided to use a heat sink with good thermal conductivity and elasticity on the opposite side of the printed board, which is placed on one side of the printed board on which electronic components are mounted, or on both sides of the printed board. A gel-like heat transfer medium in the form of a sticky flat plate is adhered, and the gel-like heat transfer medium is configured to be in close contact with at least the heat generating part of the electronic component, so that the heat generated by the component is transferred through the gel-like heat transfer medium. The cooling device, which is designed to efficiently transfer heat to the heat sink and dissipate it, is blocked.

This cooling device will be explained using FIGS. 1 to 3.

In Figures 1 to 3, lr! On the printed circuit board, -
An electronic component 2 is mounted on one side, and a pin portion protrudes from the other side. This is the rich part of the 1ari printed circuit board. Pudding) fjl has heat sinks 3 & on both sides.

3b is placed. The 3 m and 3 bri heat sinks are made of aluminum or steel plates with good thermal conductivity in order to efficiently conduct and even out the heat in the vicinity of components that generate a large amount of heat over the entire surface of the heat sink. The heat sinks 3m and 3b are fixed to the sabots 41 and 4b by a plurality of tightening screws 8. Grooves 51.5b for guiding and fixing the printed circuit board 1 are provided in the supports 45L, 4b. Sabo) 4
jL.

4b has a step with the heat dissipation plate 3m, 3b is for use as a guide groove when inserting the printed circuit board 22) into the electronic device housing shown in Figure 1, 61, 6.
Heat dissipation plate 3m, 3m, is formed into a flat plate on the surface of 3b facing the printed circuit board 11 and is adhesively made of gel-like heat transfer medium, which has excellent thermal conductivity and is flexible so as not to damage the component 2t when pressed against the electronic component 2. has. Silicon gel is used as the gel heat transfer medium 6m, 5b in 11 rows. Gel-like heat transfer medium (LA
.

6b is the heat 19 of the electronic component 2 mounted on the printed circuit board l
J: This is for transmitting information to the heat sinks 3m and 3b of the J desk.
113 As shown in figure 9! The thickness is such that it will adhere to the surface. Reference numeral 9 denotes a front panel which is integrally connected to the printed circuit board 1.

With this configuration, the heat generated from the electronic component 2 is transferred to the heat sinks 31, 3bK via the gel-like heat transfer medium @h, 5b.
Denmi Rarel, heat dissipation [3&, 3bO area is electronic parts 2t-
Due to the spacing required when mounting on the printed circuit board 1, the surface area of the parts is several times larger than the total surface area of the parts. Therefore, heat dissipation can be performed well. In addition, there is a 3m heat sink.

3b is made of a material with good thermal conductivity, so even if there are parts that generate a large amount of heat locally, the temperature distribution is made uniform over the entire [fFK]. Therefore, when considering a component that generates a large amount of heat, the equivalent heat radiation area becomes very large, and the heat radiation effect can be extremely improved. Also,
Since the electronic component 2 is not directly exposed to the atmosphere, dust will not accumulate on the component even in a bad environment, and the bottle portion will not be corroded by corrosive gas.

K for use in such a cooling device 1* is required to be able to easily adhere the gel heat transfer medium to the heat sink.

The purpose of this invention is to provide a method for manufacturing a heat sink having a gel-like heat transfer medium so that the heat sink used in such a cooling device can be easily manufactured.

The main feature of this book is that a bendable sheet is attached to the plate facing the heat sink, which is in contact with the gel-like heat transfer medium.

Next, a method of manufacturing a heat sink according to the present invention is shown in FIGS. 4 to 6 using a tube. I will clarify. Note that the following description will be made regarding the heat sink 3m and the heat transfer medium 6a. In the figure aar
i For the above-mentioned heating plate, silicone gel is used for the 6m heat transfer medium. Silicone gel is in a liquid state when injected, and becomes a gel after being heated and cured (for example, at 120 C for 3 hours). 1
01.10bd It is made of non-metallic lumber for growing the heat transfer medium 6a. 11 is a foldable sheet of approximately α1■, which is bendable and can withstand the heat during heating! Color sheets, Teflon sheets, vinyl sheets, etc. are used.

The unexploded fIA has a cylindrical structure, and the work involved first arranging it as shown in Figure 4, assembling it as shown in Figure 5, and then tightening it as shown in Figure 5. Attachment is done with screws or Paneka T-motsu clips, etc.)
Then, a resin such as silicone gel is injected, and after heating for 7JIII, ml (1.10bt) is removed to form the state shown in FIG. 6. At this time, the solder material 10b and the sheet 11 can be separated very easily.

After this, the sheet 1lt is peeled off while being folded back as shown in FIG. 6, and this peeling can also be easily performed. In addition, without this sheet 11, the lumber 10
When removing bt, this is a very difficult task, if not impossible, since it is rounded almost like a rigid body, and the gel-like heat transfer medium 6a is in contact with gtab and the heat sink SaK beam with the same area. .

As described above, according to the present invention, the peeling operation is greatly improved simply by attaching the sheet 11 to the oak tree 10b. As a result, it is possible to easily manufacture a heat dissipation temporary tube having a pulverulent heat transfer medium.

[Brief explanation of the drawing]

Fig. 1 Fig. 3 shows a row of cooling devices to which the heat sink according to the present invention is applied, Fig. 81 is a perspective view, and Fig. 2 is a first
FIG. 3 is an enlarged view of Bs in FIG. 2, and FIG. 41A-FIG. 6 is a block diagram showing one actual row of the present invention. 1... Printed circuit board, 2... Electronic component, 3... Heat sink, 10th V, 4 Port 62nd

Claims (1)

[Claims] 1. When molding the gel-like resin tube as a heat-transfer medium as an integral part with the heat-radiating plate, a bendable sheet T-mounted on the surface of the solder material facing the heat-radiating plate that is in contact with the gel-like heat-transfer medium. A method for manufacturing a heat sink having a gel-like heat transfer medium made of t-% mold.