JPS5797656A - Forming material for sealing electronical parts - Google Patents

Forming material for sealing electronical parts

Info

Publication number
JPS5797656A
JPS5797656A JP55174966A JP17496680A JPS5797656A JP S5797656 A JPS5797656 A JP S5797656A JP 55174966 A JP55174966 A JP 55174966A JP 17496680 A JP17496680 A JP 17496680A JP S5797656 A JPS5797656 A JP S5797656A
Authority
JP
Japan
Prior art keywords
weight parts
sealing
parts
forming material
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55174966A
Other languages
Japanese (ja)
Other versions
JPS6118342B2 (en
Inventor
Kensaku Morii
Munetomo Torii
Hiroyuki Fujii
Kenichi Tateno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd, Matsushita Electric Works Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP55174966A priority Critical patent/JPS5797656A/en
Publication of JPS5797656A publication Critical patent/JPS5797656A/en
Publication of JPS6118342B2 publication Critical patent/JPS6118342B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve adhesiveness with metallic parts by adding copolymerized monomers, unsaturated epoxy resin and fibrous material to unsaturated polyester resin. CONSTITUTION:Copolymerized monomers of 5-200 weight parts, unsaturated epoxy resin of 10-500 weight parts and fibrous material 100-500 weight parts are added to unsaturated polyester resin of 100 weight parts to make a fundamental composition. If necessary, inorganic filler, organic filler, separator, coloring material, hardening, ultraviolet ray absorber and coupling chemical are added to the composition and well mixed or blended.
JP55174966A 1980-12-10 1980-12-10 Forming material for sealing electronical parts Granted JPS5797656A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55174966A JPS5797656A (en) 1980-12-10 1980-12-10 Forming material for sealing electronical parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55174966A JPS5797656A (en) 1980-12-10 1980-12-10 Forming material for sealing electronical parts

Publications (2)

Publication Number Publication Date
JPS5797656A true JPS5797656A (en) 1982-06-17
JPS6118342B2 JPS6118342B2 (en) 1986-05-12

Family

ID=15987844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55174966A Granted JPS5797656A (en) 1980-12-10 1980-12-10 Forming material for sealing electronical parts

Country Status (1)

Country Link
JP (1) JPS5797656A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588719A (en) * 1981-07-09 1983-01-18 Matsushita Electric Works Ltd Unsaturated polyester resin molding material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588719A (en) * 1981-07-09 1983-01-18 Matsushita Electric Works Ltd Unsaturated polyester resin molding material

Also Published As

Publication number Publication date
JPS6118342B2 (en) 1986-05-12

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