JPS5796562A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS5796562A
JPS5796562A JP55173521A JP17352180A JPS5796562A JP S5796562 A JPS5796562 A JP S5796562A JP 55173521 A JP55173521 A JP 55173521A JP 17352180 A JP17352180 A JP 17352180A JP S5796562 A JPS5796562 A JP S5796562A
Authority
JP
Japan
Prior art keywords
corners
supporting frame
pellet
lead
hangers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55173521A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6134254B2 (oth
Inventor
Takashi Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55173521A priority Critical patent/JPS5796562A/ja
Publication of JPS5796562A publication Critical patent/JPS5796562A/ja
Publication of JPS6134254B2 publication Critical patent/JPS6134254B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP55173521A 1980-12-09 1980-12-09 Semiconductor device and manufacture thereof Granted JPS5796562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55173521A JPS5796562A (en) 1980-12-09 1980-12-09 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55173521A JPS5796562A (en) 1980-12-09 1980-12-09 Semiconductor device and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS5796562A true JPS5796562A (en) 1982-06-15
JPS6134254B2 JPS6134254B2 (oth) 1986-08-06

Family

ID=15962062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55173521A Granted JPS5796562A (en) 1980-12-09 1980-12-09 Semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5796562A (oth)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188251A (ja) * 1986-02-13 1987-08-17 Nec Corp 集積回路の実装構造
US4890152A (en) * 1986-02-14 1989-12-26 Matsushita Electric Works, Ltd. Plastic molded chip carrier package and method of fabricating the same
JPH02163949A (ja) * 1988-12-17 1990-06-25 Ibiden Co Ltd 半導体搭載用基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5232267A (en) * 1975-09-05 1977-03-11 Citizen Watch Co Ltd Ic packaging construction

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5232267A (en) * 1975-09-05 1977-03-11 Citizen Watch Co Ltd Ic packaging construction

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188251A (ja) * 1986-02-13 1987-08-17 Nec Corp 集積回路の実装構造
US4890152A (en) * 1986-02-14 1989-12-26 Matsushita Electric Works, Ltd. Plastic molded chip carrier package and method of fabricating the same
JPH02163949A (ja) * 1988-12-17 1990-06-25 Ibiden Co Ltd 半導体搭載用基板

Also Published As

Publication number Publication date
JPS6134254B2 (oth) 1986-08-06

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