JPS5794946U - - Google Patents

Info

Publication number
JPS5794946U
JPS5794946U JP1980173339U JP17333980U JPS5794946U JP S5794946 U JPS5794946 U JP S5794946U JP 1980173339 U JP1980173339 U JP 1980173339U JP 17333980 U JP17333980 U JP 17333980U JP S5794946 U JPS5794946 U JP S5794946U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1980173339U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980173339U priority Critical patent/JPS5794946U/ja
Publication of JPS5794946U publication Critical patent/JPS5794946U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP1980173339U 1980-12-03 1980-12-03 Pending JPS5794946U (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980173339U JPS5794946U (OSRAM) 1980-12-03 1980-12-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980173339U JPS5794946U (OSRAM) 1980-12-03 1980-12-03

Publications (1)

Publication Number Publication Date
JPS5794946U true JPS5794946U (OSRAM) 1982-06-11

Family

ID=29531569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980173339U Pending JPS5794946U (OSRAM) 1980-12-03 1980-12-03

Country Status (1)

Country Link
JP (1) JPS5794946U (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60143639A (ja) * 1983-12-29 1985-07-29 Konishiroku Photo Ind Co Ltd 集積回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60143639A (ja) * 1983-12-29 1985-07-29 Konishiroku Photo Ind Co Ltd 集積回路装置

Similar Documents

Publication Publication Date Title
FR2473621B1 (OSRAM)
CH663511GA3 (OSRAM)
DE3153460A1 (OSRAM)
FR2473396B1 (OSRAM)
DE3152204T1 (OSRAM)
FR2485689B1 (OSRAM)
FR2473422B1 (OSRAM)
DE3050962A1 (OSRAM)
DE3153680A1 (OSRAM)
FR2472955B1 (OSRAM)
FR2473559B1 (OSRAM)
DE3050253T1 (OSRAM)
FR2473201B3 (OSRAM)
FR2473091B1 (OSRAM)
CH655525B (OSRAM)
FR2473449B1 (OSRAM)
FR2473469B1 (OSRAM)
FR2473161B1 (OSRAM)
CH641627GA3 (OSRAM)
FR2473563B1 (OSRAM)
FR2467999B2 (OSRAM)
FR2473430B1 (OSRAM)
FR2473501B1 (OSRAM)
FR2473480B1 (OSRAM)
FR2473228B1 (OSRAM)