JPS578756U - - Google Patents

Info

Publication number
JPS578756U
JPS578756U JP1980085158U JP8515880U JPS578756U JP S578756 U JPS578756 U JP S578756U JP 1980085158 U JP1980085158 U JP 1980085158U JP 8515880 U JP8515880 U JP 8515880U JP S578756 U JPS578756 U JP S578756U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980085158U
Other languages
Japanese (ja)
Other versions
JPS6120760Y2 (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980085158U priority Critical patent/JPS6120760Y2/ja
Publication of JPS578756U publication Critical patent/JPS578756U/ja
Application granted granted Critical
Publication of JPS6120760Y2 publication Critical patent/JPS6120760Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1980085158U 1980-06-17 1980-06-17 Expired JPS6120760Y2 (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980085158U JPS6120760Y2 (OSRAM) 1980-06-17 1980-06-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980085158U JPS6120760Y2 (OSRAM) 1980-06-17 1980-06-17

Publications (2)

Publication Number Publication Date
JPS578756U true JPS578756U (OSRAM) 1982-01-18
JPS6120760Y2 JPS6120760Y2 (OSRAM) 1986-06-21

Family

ID=29447427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980085158U Expired JPS6120760Y2 (OSRAM) 1980-06-17 1980-06-17

Country Status (1)

Country Link
JP (1) JPS6120760Y2 (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61164668U (OSRAM) * 1985-03-29 1986-10-13
JP2006303455A (ja) * 2005-03-23 2006-11-02 Toyota Motor Corp パワー半導体モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52117551A (en) * 1976-03-29 1977-10-03 Mitsubishi Electric Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52117551A (en) * 1976-03-29 1977-10-03 Mitsubishi Electric Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61164668U (OSRAM) * 1985-03-29 1986-10-13
JP2006303455A (ja) * 2005-03-23 2006-11-02 Toyota Motor Corp パワー半導体モジュール
US8269331B2 (en) 2005-03-23 2012-09-18 Toyota Jidosha Kabushiki Kaisha Power semiconductor module

Also Published As

Publication number Publication date
JPS6120760Y2 (OSRAM) 1986-06-21

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