JPS578249A - Curable composition - Google Patents

Curable composition

Info

Publication number
JPS578249A
JPS578249A JP8372380A JP8372380A JPS578249A JP S578249 A JPS578249 A JP S578249A JP 8372380 A JP8372380 A JP 8372380A JP 8372380 A JP8372380 A JP 8372380A JP S578249 A JPS578249 A JP S578249A
Authority
JP
Japan
Prior art keywords
contg
platinum
catalyst
peroxide
org
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8372380A
Other languages
Japanese (ja)
Other versions
JPS6217625B2 (en
Inventor
Masayuki Hatanaka
Atsushi Kurita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Momentive Performance Materials Japan LLC
Original Assignee
Toshiba Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Silicone Co Ltd filed Critical Toshiba Silicone Co Ltd
Priority to JP8372380A priority Critical patent/JPS578249A/en
Publication of JPS578249A publication Critical patent/JPS578249A/en
Publication of JPS6217625B2 publication Critical patent/JPS6217625B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To provide a curable silicone compsn. which can form a silicon rubber contg. fine transition metal powder and has excellent shelf stability, by using a specified platinum complex-org. peroxide catalyst. CONSTITUTION:A mixture composed of one equivalent (calculated as platinum metal) of a platinum complex (a) contg. no halogen [e.g. tetrakis-(triethylphosphine)platinum] and 2-1,000 equivalents of an org. peroxide (b) contg. no hydroperoxy bond (e.g. di-tert-butyl peroxide), is used as a catalyst. 100pts.wt. Polyorganopolysiloxane (A) having at least two vinyl groups bonded to the silicon atom, 0.1-10pts.wt. polyorganohydrogensiloxane (B) having at least two hydrogen atoms bonded to the silicon atom, 5-500pts.wt. fine powder of a transition metal (C) (e.g. tungsten), and the above catalyst (D) are blended together to produce the desired curable compsn.
JP8372380A 1980-06-20 1980-06-20 Curable composition Granted JPS578249A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8372380A JPS578249A (en) 1980-06-20 1980-06-20 Curable composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8372380A JPS578249A (en) 1980-06-20 1980-06-20 Curable composition

Publications (2)

Publication Number Publication Date
JPS578249A true JPS578249A (en) 1982-01-16
JPS6217625B2 JPS6217625B2 (en) 1987-04-18

Family

ID=13810428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8372380A Granted JPS578249A (en) 1980-06-20 1980-06-20 Curable composition

Country Status (1)

Country Link
JP (1) JPS578249A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6173156A (en) * 1984-09-19 1986-04-15 Toray Ind Inc Water-free lithographic plate
JPS6198765A (en) * 1984-07-06 1986-05-17 Toshiba Silicone Co Ltd Curable polyorganosiloxane composition having gamma ray shielding ability
JPH07110574A (en) * 1993-12-13 1995-04-25 Toray Ind Inc Production of waterless lithographic printing plate
US6156236A (en) * 1998-03-20 2000-12-05 Shin-Etsu Chemical Co., Ltd. Conductive organopolysiloxane composition
JP2006131813A (en) * 2004-11-09 2006-05-25 Shin Etsu Chem Co Ltd Self adhesive thermosetting-accelerating-type liquid silicone rubber composition
JP2007191629A (en) * 2006-01-20 2007-08-02 Shin Etsu Chem Co Ltd Thermosetting composition
JP2014214209A (en) * 2013-04-25 2014-11-17 信越化学工業株式会社 Conductive silicone rubber composition
JP2021042332A (en) * 2019-09-12 2021-03-18 信越化学工業株式会社 Addition-curable silicone composition, and cured product thereof, light reflector, and light semiconductor device
JP2021075655A (en) * 2019-11-12 2021-05-20 信越化学工業株式会社 Conductive silicone composition, cured conductive silicone product, production method for cured conductive silicone product, and conductive silicone laminate
WO2021152972A1 (en) * 2020-01-31 2021-08-05 信越化学工業株式会社 Electroconductive silicone composition, cured electroconductive silicone, method for producing cured electroconductive silicone, and laminate
WO2022196410A1 (en) * 2021-03-17 2022-09-22 信越化学工業株式会社 Electroconductive silicone composition, electroconductive silicone cured product and laminate

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198765A (en) * 1984-07-06 1986-05-17 Toshiba Silicone Co Ltd Curable polyorganosiloxane composition having gamma ray shielding ability
JPH0529657B2 (en) * 1984-07-06 1993-05-06 Toshiba Shirikoon Kk
JPS6173156A (en) * 1984-09-19 1986-04-15 Toray Ind Inc Water-free lithographic plate
JPH051934B2 (en) * 1984-09-19 1993-01-11 Toray Industries
JPH07110574A (en) * 1993-12-13 1995-04-25 Toray Ind Inc Production of waterless lithographic printing plate
US6156236A (en) * 1998-03-20 2000-12-05 Shin-Etsu Chemical Co., Ltd. Conductive organopolysiloxane composition
JP2006131813A (en) * 2004-11-09 2006-05-25 Shin Etsu Chem Co Ltd Self adhesive thermosetting-accelerating-type liquid silicone rubber composition
JP2007191629A (en) * 2006-01-20 2007-08-02 Shin Etsu Chem Co Ltd Thermosetting composition
JP4628270B2 (en) * 2006-01-20 2011-02-09 信越化学工業株式会社 Thermosetting composition
JP2014214209A (en) * 2013-04-25 2014-11-17 信越化学工業株式会社 Conductive silicone rubber composition
JP2021042332A (en) * 2019-09-12 2021-03-18 信越化学工業株式会社 Addition-curable silicone composition, and cured product thereof, light reflector, and light semiconductor device
JP2021075655A (en) * 2019-11-12 2021-05-20 信越化学工業株式会社 Conductive silicone composition, cured conductive silicone product, production method for cured conductive silicone product, and conductive silicone laminate
WO2021152972A1 (en) * 2020-01-31 2021-08-05 信越化学工業株式会社 Electroconductive silicone composition, cured electroconductive silicone, method for producing cured electroconductive silicone, and laminate
JP2021121652A (en) * 2020-01-31 2021-08-26 信越化学工業株式会社 Electroconductive silicone composition, cured electroconductive silicone, method for producing cured electroconductive silicone, and laminate
WO2022196410A1 (en) * 2021-03-17 2022-09-22 信越化学工業株式会社 Electroconductive silicone composition, electroconductive silicone cured product and laminate

Also Published As

Publication number Publication date
JPS6217625B2 (en) 1987-04-18

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