JPS578050A - Positioning and indexing device for work piece material - Google Patents
Positioning and indexing device for work piece materialInfo
- Publication number
- JPS578050A JPS578050A JP8071680A JP8071680A JPS578050A JP S578050 A JPS578050 A JP S578050A JP 8071680 A JP8071680 A JP 8071680A JP 8071680 A JP8071680 A JP 8071680A JP S578050 A JPS578050 A JP S578050A
- Authority
- JP
- Japan
- Prior art keywords
- scale plate
- holes
- work piece
- row
- piece material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Jigs For Machine Tools (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8071680A JPS578050A (en) | 1980-06-14 | 1980-06-14 | Positioning and indexing device for work piece material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8071680A JPS578050A (en) | 1980-06-14 | 1980-06-14 | Positioning and indexing device for work piece material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS578050A true JPS578050A (en) | 1982-01-16 |
JPS6247654B2 JPS6247654B2 (ja) | 1987-10-08 |
Family
ID=13726062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8071680A Granted JPS578050A (en) | 1980-06-14 | 1980-06-14 | Positioning and indexing device for work piece material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS578050A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5911329A (en) * | 1996-04-30 | 1999-06-15 | Micron Technology, Inc. | Apparatus and method for facilitating circuit board processing |
US6224936B1 (en) | 1998-10-07 | 2001-05-01 | Micron Technology, Inc. | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
US6408510B1 (en) | 1998-02-13 | 2002-06-25 | Micron Technology, Inc. | Method for making chip scale packages |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007226885A (ja) * | 2006-02-23 | 2007-09-06 | Mitsumi Electric Co Ltd | 記録再生装置、それに使用される収納検出器、及び調整機構 |
-
1980
- 1980-06-14 JP JP8071680A patent/JPS578050A/ja active Granted
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6398043B1 (en) | 1996-04-30 | 2002-06-04 | Micron Technology, Inc. | Apparatus and method for facilitating circuit board processing |
US6655535B2 (en) | 1996-04-30 | 2003-12-02 | Micron Technology, Inc. | Methods for facilitating circuit board processing |
US5992649A (en) * | 1996-04-30 | 1999-11-30 | Micron Technology, Inc. | Apparatus and method for facilitating circuit board processing |
US6158595A (en) * | 1996-04-30 | 2000-12-12 | Micron Technology, Inc. | Apparatus and method for facilitating circuit board processing |
US6279758B1 (en) * | 1996-04-30 | 2001-08-28 | Micron Technology, Inc. | Apparatus and method for facilitating circuit board processing |
US5988619A (en) * | 1996-04-30 | 1999-11-23 | Micron Technology, Inc. | Apparatus and method for facilitating circuit board processing |
US5911329A (en) * | 1996-04-30 | 1999-06-15 | Micron Technology, Inc. | Apparatus and method for facilitating circuit board processing |
US6408510B1 (en) | 1998-02-13 | 2002-06-25 | Micron Technology, Inc. | Method for making chip scale packages |
US6224936B1 (en) | 1998-10-07 | 2001-05-01 | Micron Technology, Inc. | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
US6592670B1 (en) | 1998-10-07 | 2003-07-15 | Micron Technology, Inc. | Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
US6527999B2 (en) | 1998-10-07 | 2003-03-04 | Micron Technology, Inc. | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
US6764549B2 (en) | 1998-10-07 | 2004-07-20 | Micron Technology, Inc. | Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
US6830719B2 (en) | 1998-10-07 | 2004-12-14 | Micron Technology, Inc. | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
US7166252B2 (en) | 1998-10-07 | 2007-01-23 | Micron Technology, Inc. | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS6247654B2 (ja) | 1987-10-08 |
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