JPS5776775A - Method of soldering lead wire - Google Patents

Method of soldering lead wire

Info

Publication number
JPS5776775A
JPS5776775A JP15252780A JP15252780A JPS5776775A JP S5776775 A JPS5776775 A JP S5776775A JP 15252780 A JP15252780 A JP 15252780A JP 15252780 A JP15252780 A JP 15252780A JP S5776775 A JPS5776775 A JP S5776775A
Authority
JP
Japan
Prior art keywords
lead wire
soldering lead
soldering
wire
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15252780A
Other languages
English (en)
Japanese (ja)
Other versions
JPH024999B2 (h
Inventor
Yoshimitsu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suwa Seikosha KK
Original Assignee
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suwa Seikosha KK filed Critical Suwa Seikosha KK
Priority to JP15252780A priority Critical patent/JPS5776775A/ja
Publication of JPS5776775A publication Critical patent/JPS5776775A/ja
Publication of JPH024999B2 publication Critical patent/JPH024999B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP15252780A 1980-10-30 1980-10-30 Method of soldering lead wire Granted JPS5776775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15252780A JPS5776775A (en) 1980-10-30 1980-10-30 Method of soldering lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15252780A JPS5776775A (en) 1980-10-30 1980-10-30 Method of soldering lead wire

Publications (2)

Publication Number Publication Date
JPS5776775A true JPS5776775A (en) 1982-05-13
JPH024999B2 JPH024999B2 (h) 1990-01-31

Family

ID=15542378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15252780A Granted JPS5776775A (en) 1980-10-30 1980-10-30 Method of soldering lead wire

Country Status (1)

Country Link
JP (1) JPS5776775A (h)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596569A (ja) * 1982-07-05 1984-01-13 Nec Corp 混成集積回路の製造方法
JPS59144194A (ja) * 1983-02-07 1984-08-18 株式会社日立製作所 セラミツクス基板の半田付け用端子
JPH0465158A (ja) * 1990-07-05 1992-03-02 Mitsubishi Electric Corp 半導体装置の製造方法
JPH0789479A (ja) * 1991-02-26 1995-04-04 Shoichi Otani 自転車
JP2007150200A (ja) * 2005-11-30 2007-06-14 Murata Mfg Co Ltd 電子部品の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536882A (en) * 1976-07-09 1978-01-21 Hitachi Ltd Thick circuit substrate
JPS5313247U (h) * 1976-07-16 1978-02-03

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536882A (en) * 1976-07-09 1978-01-21 Hitachi Ltd Thick circuit substrate
JPS5313247U (h) * 1976-07-16 1978-02-03

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596569A (ja) * 1982-07-05 1984-01-13 Nec Corp 混成集積回路の製造方法
JPS59144194A (ja) * 1983-02-07 1984-08-18 株式会社日立製作所 セラミツクス基板の半田付け用端子
JPH0465158A (ja) * 1990-07-05 1992-03-02 Mitsubishi Electric Corp 半導体装置の製造方法
JPH0789479A (ja) * 1991-02-26 1995-04-04 Shoichi Otani 自転車
JP2007150200A (ja) * 2005-11-30 2007-06-14 Murata Mfg Co Ltd 電子部品の製造方法

Also Published As

Publication number Publication date
JPH024999B2 (h) 1990-01-31

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