JPS5774114A - Connecting method of laminated board - Google Patents

Connecting method of laminated board

Info

Publication number
JPS5774114A
JPS5774114A JP15066380A JP15066380A JPS5774114A JP S5774114 A JPS5774114 A JP S5774114A JP 15066380 A JP15066380 A JP 15066380A JP 15066380 A JP15066380 A JP 15066380A JP S5774114 A JPS5774114 A JP S5774114A
Authority
JP
Japan
Prior art keywords
thin
boards
metal granules
adhesives
mixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15066380A
Other languages
Japanese (ja)
Inventor
Yasuo Ishimaru
Yoichi Uchimaki
Toshiaki Umaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15066380A priority Critical patent/JPS5774114A/en
Publication of JPS5774114A publication Critical patent/JPS5774114A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To reduce the number of processing stages and the cost of materials by connecting thin boards with adhesives, without using window frame type thin boards, by securing gaps of a fixed amount with metal granules arranged between the connecting parts of thin boards.
CONSTITUTION: For example, metal granules 4 of 0.2W0.5mm are mixed in adhesive 3 and after stirring the adhesives 3 are applied to the connecting part of a thin board 1 where many fine holes are provided and another thin board 1 is placed over the said thin board 1 and pressed lightly each other. By repeating the above process an intended laminated boards wherein gaps of a fixed amount are secured can be obtained. When thin boards are connected together by soldering, said metal granules are mixed in a paste and used for connection.
COPYRIGHT: (C)1982,JPO&Japio
JP15066380A 1980-10-29 1980-10-29 Connecting method of laminated board Pending JPS5774114A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15066380A JPS5774114A (en) 1980-10-29 1980-10-29 Connecting method of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15066380A JPS5774114A (en) 1980-10-29 1980-10-29 Connecting method of laminated board

Publications (1)

Publication Number Publication Date
JPS5774114A true JPS5774114A (en) 1982-05-10

Family

ID=15501758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15066380A Pending JPS5774114A (en) 1980-10-29 1980-10-29 Connecting method of laminated board

Country Status (1)

Country Link
JP (1) JPS5774114A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4865672A (en) * 1987-06-12 1989-09-12 Teroson Gmbh Process for bonding two substantially flat elements with spacers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4865672A (en) * 1987-06-12 1989-09-12 Teroson Gmbh Process for bonding two substantially flat elements with spacers

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