JPS5773953U - - Google Patents
Info
- Publication number
- JPS5773953U JPS5773953U JP15103380U JP15103380U JPS5773953U JP S5773953 U JPS5773953 U JP S5773953U JP 15103380 U JP15103380 U JP 15103380U JP 15103380 U JP15103380 U JP 15103380U JP S5773953 U JPS5773953 U JP S5773953U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Connecting Device With Holders (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15103380U JPS62216Y2 (en:Method) | 1980-10-24 | 1980-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15103380U JPS62216Y2 (en:Method) | 1980-10-24 | 1980-10-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5773953U true JPS5773953U (en:Method) | 1982-05-07 |
| JPS62216Y2 JPS62216Y2 (en:Method) | 1987-01-07 |
Family
ID=29510376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15103380U Expired JPS62216Y2 (en:Method) | 1980-10-24 | 1980-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62216Y2 (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7144805B2 (en) | 1998-02-04 | 2006-12-05 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
-
1980
- 1980-10-24 JP JP15103380U patent/JPS62216Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7144805B2 (en) | 1998-02-04 | 2006-12-05 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
| US7244677B2 (en) | 1998-02-04 | 2007-07-17 | Semitool. Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62216Y2 (en:Method) | 1987-01-07 |