JPS5773933U - - Google Patents

Info

Publication number
JPS5773933U
JPS5773933U JP1980149864U JP14986480U JPS5773933U JP S5773933 U JPS5773933 U JP S5773933U JP 1980149864 U JP1980149864 U JP 1980149864U JP 14986480 U JP14986480 U JP 14986480U JP S5773933 U JPS5773933 U JP S5773933U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980149864U
Other languages
Japanese (ja)
Other versions
JPS6133643Y2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980149864U priority Critical patent/JPS6133643Y2/ja
Publication of JPS5773933U publication Critical patent/JPS5773933U/ja
Application granted granted Critical
Publication of JPS6133643Y2 publication Critical patent/JPS6133643Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344Eccentric cams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1980149864U 1980-10-21 1980-10-21 Expired JPS6133643Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980149864U JPS6133643Y2 (en:Method) 1980-10-21 1980-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980149864U JPS6133643Y2 (en:Method) 1980-10-21 1980-10-21

Publications (2)

Publication Number Publication Date
JPS5773933U true JPS5773933U (en:Method) 1982-05-07
JPS6133643Y2 JPS6133643Y2 (en:Method) 1986-10-01

Family

ID=29509238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980149864U Expired JPS6133643Y2 (en:Method) 1980-10-21 1980-10-21

Country Status (1)

Country Link
JP (1) JPS6133643Y2 (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188839A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Vertical moving mechanism for capillary

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188839A (en) * 1981-05-15 1982-11-19 Shinkawa Ltd Vertical moving mechanism for capillary

Also Published As

Publication number Publication date
JPS6133643Y2 (en:Method) 1986-10-01

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