JPS5773932U - - Google Patents

Info

Publication number
JPS5773932U
JPS5773932U JP1980151967U JP15196780U JPS5773932U JP S5773932 U JPS5773932 U JP S5773932U JP 1980151967 U JP1980151967 U JP 1980151967U JP 15196780 U JP15196780 U JP 15196780U JP S5773932 U JPS5773932 U JP S5773932U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1980151967U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980151967U priority Critical patent/JPS5773932U/ja
Publication of JPS5773932U publication Critical patent/JPS5773932U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1980151967U 1980-10-23 1980-10-23 Pending JPS5773932U (index.php)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980151967U JPS5773932U (index.php) 1980-10-23 1980-10-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980151967U JPS5773932U (index.php) 1980-10-23 1980-10-23

Publications (1)

Publication Number Publication Date
JPS5773932U true JPS5773932U (index.php) 1982-05-07

Family

ID=29511281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980151967U Pending JPS5773932U (index.php) 1980-10-23 1980-10-23

Country Status (1)

Country Link
JP (1) JPS5773932U (index.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63211638A (ja) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd 樹脂封止型半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63211638A (ja) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd 樹脂封止型半導体装置の製造方法

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