JPS577137A - Separation of semiconductor device - Google Patents

Separation of semiconductor device

Info

Publication number
JPS577137A
JPS577137A JP8171380A JP8171380A JPS577137A JP S577137 A JPS577137 A JP S577137A JP 8171380 A JP8171380 A JP 8171380A JP 8171380 A JP8171380 A JP 8171380A JP S577137 A JPS577137 A JP S577137A
Authority
JP
Japan
Prior art keywords
wafer
pellets
groove
separation
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8171380A
Other languages
English (en)
Other versions
JPS5847856B2 (ja
Inventor
Masayasu Abe
Masafumi Miyagawa
Masaharu Aoyama
Toshio Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55081713A priority Critical patent/JPS5847856B2/ja
Publication of JPS577137A publication Critical patent/JPS577137A/ja
Publication of JPS5847856B2 publication Critical patent/JPS5847856B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP55081713A 1980-06-17 1980-06-17 半導体ウエハの分離方法 Expired JPS5847856B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55081713A JPS5847856B2 (ja) 1980-06-17 1980-06-17 半導体ウエハの分離方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55081713A JPS5847856B2 (ja) 1980-06-17 1980-06-17 半導体ウエハの分離方法

Publications (2)

Publication Number Publication Date
JPS577137A true JPS577137A (en) 1982-01-14
JPS5847856B2 JPS5847856B2 (ja) 1983-10-25

Family

ID=13754029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55081713A Expired JPS5847856B2 (ja) 1980-06-17 1980-06-17 半導体ウエハの分離方法

Country Status (1)

Country Link
JP (1) JPS5847856B2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009130128A (ja) * 2007-11-22 2009-06-11 Denso Corp ウエハの分割方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009130128A (ja) * 2007-11-22 2009-06-11 Denso Corp ウエハの分割方法

Also Published As

Publication number Publication date
JPS5847856B2 (ja) 1983-10-25

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