JPS576699B2 - - Google Patents
Info
- Publication number
- JPS576699B2 JPS576699B2 JP3170772A JP3170772A JPS576699B2 JP S576699 B2 JPS576699 B2 JP S576699B2 JP 3170772 A JP3170772 A JP 3170772A JP 3170772 A JP3170772 A JP 3170772A JP S576699 B2 JPS576699 B2 JP S576699B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3170772A JPS576699B2 (ja) | 1972-03-31 | 1972-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3170772A JPS576699B2 (ja) | 1972-03-31 | 1972-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4899655A JPS4899655A (ja) | 1973-12-17 |
| JPS576699B2 true JPS576699B2 (ja) | 1982-02-06 |
Family
ID=12338528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3170772A Expired JPS576699B2 (ja) | 1972-03-31 | 1972-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS576699B2 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61181135A (ja) * | 1985-02-06 | 1986-08-13 | Matsushita Electric Ind Co Ltd | 印刷配線基板 |
| JPH06112375A (ja) * | 1992-09-24 | 1994-04-22 | Kyocera Corp | 半導体素子収納用パッケージ |
-
1972
- 1972-03-31 JP JP3170772A patent/JPS576699B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4899655A (ja) | 1973-12-17 |