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Filing date
Publication date
Application filedfiledCritical
Priority to JP50079015ApriorityCriticalpatent/JPS523387A/ja
Publication of JPS523387ApublicationCriticalpatent/JPS523387A/ja
Publication of JPS576252B2publicationCriticalpatent/JPS576252B2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/11—Manufacturing methods
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Electrodes Of Semiconductors
(AREA)
JP50079015A1975-06-241975-06-24Manufacturing method of semiconductor device
GrantedJPS523387A
(en)
