JPS5761853U - - Google Patents

Info

Publication number
JPS5761853U
JPS5761853U JP1980138794U JP13879480U JPS5761853U JP S5761853 U JPS5761853 U JP S5761853U JP 1980138794 U JP1980138794 U JP 1980138794U JP 13879480 U JP13879480 U JP 13879480U JP S5761853 U JPS5761853 U JP S5761853U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980138794U
Other languages
Japanese (ja)
Other versions
JPS615804Y2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980138794U priority Critical patent/JPS615804Y2/ja
Publication of JPS5761853U publication Critical patent/JPS5761853U/ja
Application granted granted Critical
Publication of JPS615804Y2 publication Critical patent/JPS615804Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Electric Clocks (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1980138794U 1980-09-30 1980-09-30 Expired JPS615804Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980138794U JPS615804Y2 (cs) 1980-09-30 1980-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980138794U JPS615804Y2 (cs) 1980-09-30 1980-09-30

Publications (2)

Publication Number Publication Date
JPS5761853U true JPS5761853U (cs) 1982-04-13
JPS615804Y2 JPS615804Y2 (cs) 1986-02-21

Family

ID=29498789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980138794U Expired JPS615804Y2 (cs) 1980-09-30 1980-09-30

Country Status (1)

Country Link
JP (1) JPS615804Y2 (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945929U (ja) * 1982-09-20 1984-03-27 富士電機株式会社 半導体素子の実装構造
WO2007105763A1 (ja) * 2006-03-14 2007-09-20 Sharp Kabushiki Kaisha 回路基板、電子回路装置及び表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860873A (cs) * 1971-11-30 1973-08-25
JPS4924076A (cs) * 1972-05-05 1974-03-04

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860873A (cs) * 1971-11-30 1973-08-25
JPS4924076A (cs) * 1972-05-05 1974-03-04

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945929U (ja) * 1982-09-20 1984-03-27 富士電機株式会社 半導体素子の実装構造
WO2007105763A1 (ja) * 2006-03-14 2007-09-20 Sharp Kabushiki Kaisha 回路基板、電子回路装置及び表示装置
EP2007180A4 (en) * 2006-03-14 2011-03-23 Sharp Kk PCB, ELECTRONIC CIRCUIT ARRANGEMENT AND DISPLAY

Also Published As

Publication number Publication date
JPS615804Y2 (cs) 1986-02-21

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