JPS5758775B2 - - Google Patents
Info
- Publication number
- JPS5758775B2 JPS5758775B2 JP12174875A JP12174875A JPS5758775B2 JP S5758775 B2 JPS5758775 B2 JP S5758775B2 JP 12174875 A JP12174875 A JP 12174875A JP 12174875 A JP12174875 A JP 12174875A JP S5758775 B2 JPS5758775 B2 JP S5758775B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12174875A JPS5247369A (en) | 1975-10-08 | 1975-10-08 | Method of polishing semiconductor materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12174875A JPS5247369A (en) | 1975-10-08 | 1975-10-08 | Method of polishing semiconductor materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5247369A JPS5247369A (en) | 1977-04-15 |
| JPS5758775B2 true JPS5758775B2 (en:Method) | 1982-12-11 |
Family
ID=14818896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12174875A Granted JPS5247369A (en) | 1975-10-08 | 1975-10-08 | Method of polishing semiconductor materials |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5247369A (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH083540A (ja) * | 1994-06-22 | 1996-01-09 | Sony Corp | 化学機械研磨用微粒子およびその製造方法ならびにこれを用いた研磨方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5927316B2 (ja) * | 1976-06-11 | 1984-07-04 | 日本電信電話株式会社 | 結晶の無じよう乱鏡面研摩方法 |
| DE3735158A1 (de) * | 1987-10-16 | 1989-05-03 | Wacker Chemitronic | Verfahren zum schleierfreien polieren von halbleiterscheiben |
| JPH11302635A (ja) * | 1998-04-24 | 1999-11-02 | Hiroaki Tanaka | 研磨用組成物及びそれを使用した研磨方法 |
| JP2005286047A (ja) | 2004-03-29 | 2005-10-13 | Nitta Haas Inc | 半導体研磨用組成物 |
| GB0407198D0 (en) | 2004-03-30 | 2004-05-05 | British Telecomm | Joint fault detection |
| JP2007258606A (ja) * | 2006-03-24 | 2007-10-04 | Fujifilm Corp | 化学的機械的研磨用研磨液 |
-
1975
- 1975-10-08 JP JP12174875A patent/JPS5247369A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH083540A (ja) * | 1994-06-22 | 1996-01-09 | Sony Corp | 化学機械研磨用微粒子およびその製造方法ならびにこれを用いた研磨方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5247369A (en) | 1977-04-15 |