JPS5758346A - Tape carrier for semiconductor device - Google Patents

Tape carrier for semiconductor device

Info

Publication number
JPS5758346A
JPS5758346A JP55132538A JP13253880A JPS5758346A JP S5758346 A JPS5758346 A JP S5758346A JP 55132538 A JP55132538 A JP 55132538A JP 13253880 A JP13253880 A JP 13253880A JP S5758346 A JPS5758346 A JP S5758346A
Authority
JP
Japan
Prior art keywords
tape carrier
groove
gap
semiconductor device
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55132538A
Other languages
English (en)
Japanese (ja)
Other versions
JPS625340B2 (enrdf_load_html_response
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55132538A priority Critical patent/JPS5758346A/ja
Publication of JPS5758346A publication Critical patent/JPS5758346A/ja
Publication of JPS625340B2 publication Critical patent/JPS625340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP55132538A 1980-09-24 1980-09-24 Tape carrier for semiconductor device Granted JPS5758346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55132538A JPS5758346A (en) 1980-09-24 1980-09-24 Tape carrier for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55132538A JPS5758346A (en) 1980-09-24 1980-09-24 Tape carrier for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5758346A true JPS5758346A (en) 1982-04-08
JPS625340B2 JPS625340B2 (enrdf_load_html_response) 1987-02-04

Family

ID=15083613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55132538A Granted JPS5758346A (en) 1980-09-24 1980-09-24 Tape carrier for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5758346A (enrdf_load_html_response)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6358848A (ja) * 1986-08-29 1988-03-14 Toshiba Corp フイルムキヤリア基板
JPS6367741A (ja) * 1986-06-26 1988-03-26 ナショナル・セミコンダクタ−・コ−ポレ−ション ヒンジ・テ−プ
JPH0444148U (enrdf_load_html_response) * 1990-08-20 1992-04-15
JPH04196555A (ja) * 1990-11-28 1992-07-16 Sharp Corp Ｔａｂパッケージ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0238995U (enrdf_load_html_response) * 1988-09-06 1990-03-15

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6367741A (ja) * 1986-06-26 1988-03-26 ナショナル・セミコンダクタ−・コ−ポレ−ション ヒンジ・テ−プ
JPS6358848A (ja) * 1986-08-29 1988-03-14 Toshiba Corp フイルムキヤリア基板
JPH0444148U (enrdf_load_html_response) * 1990-08-20 1992-04-15
JPH04196555A (ja) * 1990-11-28 1992-07-16 Sharp Corp Ｔａｂパッケージ

Also Published As

Publication number Publication date
JPS625340B2 (enrdf_load_html_response) 1987-02-04

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