JPS5757866B2 - - Google Patents

Info

Publication number
JPS5757866B2
JPS5757866B2 JP53074221A JP7422178A JPS5757866B2 JP S5757866 B2 JPS5757866 B2 JP S5757866B2 JP 53074221 A JP53074221 A JP 53074221A JP 7422178 A JP7422178 A JP 7422178A JP S5757866 B2 JPS5757866 B2 JP S5757866B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53074221A
Other languages
Japanese (ja)
Other versions
JPS553617A (en
Inventor
Terumi Nakazawa
Tadao Suzuki
Hitoshi Minorikawa
Kenji Tabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7422178A priority Critical patent/JPS553617A/ja
Publication of JPS553617A publication Critical patent/JPS553617A/ja
Publication of JPS5757866B2 publication Critical patent/JPS5757866B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal

Landscapes

  • Casings For Electric Apparatus (AREA)
JP7422178A 1978-06-21 1978-06-21 Metallic base for hybrid integrated circuit Granted JPS553617A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7422178A JPS553617A (en) 1978-06-21 1978-06-21 Metallic base for hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7422178A JPS553617A (en) 1978-06-21 1978-06-21 Metallic base for hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS553617A JPS553617A (en) 1980-01-11
JPS5757866B2 true JPS5757866B2 (ko) 1982-12-07

Family

ID=13540906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7422178A Granted JPS553617A (en) 1978-06-21 1978-06-21 Metallic base for hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS553617A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0239485Y2 (ko) * 1985-10-22 1990-10-23

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5882550A (ja) * 1981-11-10 1983-05-18 Fujitsu Ltd 半導体装置
JP2788672B2 (ja) * 1989-12-19 1998-08-20 富士通株式会社 半導体装置
JP2505068Y2 (ja) * 1990-10-30 1996-07-24 富士電機株式会社 半導体装置のパッケ―ジ構造
JP6699742B2 (ja) * 2016-09-20 2020-05-27 三菱電機株式会社 半導体装置
JP7095866B2 (ja) * 2018-06-14 2022-07-05 Ｎｅｃスペーステクノロジー株式会社 半導体装置の製造方法および半導体装置
WO2020050093A1 (ja) * 2018-09-03 2020-03-12 日立オートモティブシステムズ株式会社 電子制御装置
CN113906663A (zh) * 2019-06-21 2022-01-07 日立安斯泰莫株式会社 电力转换装置
US20220278004A1 (en) * 2019-11-27 2022-09-01 Mitsubishi Electric Corporation Semiconductor module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828299A (ko) * 1971-08-16 1973-04-14
JPS4979468A (ko) * 1972-12-04 1974-07-31

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4878072U (ko) * 1971-12-24 1973-09-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828299A (ko) * 1971-08-16 1973-04-14
JPS4979468A (ko) * 1972-12-04 1974-07-31

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0239485Y2 (ko) * 1985-10-22 1990-10-23

Also Published As

Publication number Publication date
JPS553617A (en) 1980-01-11

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