JPS5756528Y2 - - Google Patents
Info
- Publication number
- JPS5756528Y2 JPS5756528Y2 JP1977051082U JP5108277U JPS5756528Y2 JP S5756528 Y2 JPS5756528 Y2 JP S5756528Y2 JP 1977051082 U JP1977051082 U JP 1977051082U JP 5108277 U JP5108277 U JP 5108277U JP S5756528 Y2 JPS5756528 Y2 JP S5756528Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977051082U JPS5756528Y2 (en:Method) | 1977-04-19 | 1977-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977051082U JPS5756528Y2 (en:Method) | 1977-04-19 | 1977-04-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53145468U JPS53145468U (en:Method) | 1978-11-16 |
| JPS5756528Y2 true JPS5756528Y2 (en:Method) | 1982-12-04 |
Family
ID=28939783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977051082U Expired JPS5756528Y2 (en:Method) | 1977-04-19 | 1977-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5756528Y2 (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57199228A (en) * | 1981-06-02 | 1982-12-07 | Toshiba Corp | Wire bonding pad device |
| JPH06334100A (ja) * | 1993-05-25 | 1994-12-02 | Seiko Epson Corp | 半導体装置及びそのリードフレーム |
-
1977
- 1977-04-19 JP JP1977051082U patent/JPS5756528Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53145468U (en:Method) | 1978-11-16 |