JPS5753674U - - Google Patents
Info
- Publication number
- JPS5753674U JPS5753674U JP13009680U JP13009680U JPS5753674U JP S5753674 U JPS5753674 U JP S5753674U JP 13009680 U JP13009680 U JP 13009680U JP 13009680 U JP13009680 U JP 13009680U JP S5753674 U JPS5753674 U JP S5753674U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/737—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13009680U JPS5753674U (enFirst) | 1980-09-12 | 1980-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13009680U JPS5753674U (enFirst) | 1980-09-12 | 1980-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5753674U true JPS5753674U (enFirst) | 1982-03-29 |
Family
ID=29490424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13009680U Pending JPS5753674U (enFirst) | 1980-09-12 | 1980-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5753674U (enFirst) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993170U (ja) * | 1982-12-15 | 1984-06-25 | 三洋電機株式会社 | フラツトパツケ−ジ型ｉｃの取付構造 |
| WO1985002515A1 (fr) * | 1983-11-29 | 1985-06-06 | Ibiden Co., Ltd. | Carte de circuit imprime permettant de monter un element electronique et son procede de fabrication |
| JPH02347A (ja) * | 1989-03-24 | 1990-01-05 | Matsushita Electric Works Ltd | 電子部品チップ用チップキャリア |
| JPH0499292U (enFirst) * | 1990-03-26 | 1992-08-27 |
-
1980
- 1980-09-12 JP JP13009680U patent/JPS5753674U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993170U (ja) * | 1982-12-15 | 1984-06-25 | 三洋電機株式会社 | フラツトパツケ−ジ型ｉｃの取付構造 |
| WO1985002515A1 (fr) * | 1983-11-29 | 1985-06-06 | Ibiden Co., Ltd. | Carte de circuit imprime permettant de monter un element electronique et son procede de fabrication |
| JPH02347A (ja) * | 1989-03-24 | 1990-01-05 | Matsushita Electric Works Ltd | 電子部品チップ用チップキャリア |
| JPH0499292U (enFirst) * | 1990-03-26 | 1992-08-27 |