JPS5752072A - Display unit - Google Patents

Display unit

Info

Publication number
JPS5752072A
JPS5752072A JP12718080A JP12718080A JPS5752072A JP S5752072 A JPS5752072 A JP S5752072A JP 12718080 A JP12718080 A JP 12718080A JP 12718080 A JP12718080 A JP 12718080A JP S5752072 A JPS5752072 A JP S5752072A
Authority
JP
Japan
Prior art keywords
display unit
display
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12718080A
Inventor
Tetsuo Sadamasa
Osamu Ichikawa
Original Assignee
Tokyo Shibaura Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co filed Critical Tokyo Shibaura Electric Co
Priority to JP12718080A priority Critical patent/JPS5752072A/en
Publication of JPS5752072A publication Critical patent/JPS5752072A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
JP12718080A 1980-09-16 1980-09-16 Display unit Pending JPS5752072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12718080A JPS5752072A (en) 1980-09-16 1980-09-16 Display unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12718080A JPS5752072A (en) 1980-09-16 1980-09-16 Display unit

Publications (1)

Publication Number Publication Date
JPS5752072A true JPS5752072A (en) 1982-03-27

Family

ID=14953646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12718080A Pending JPS5752072A (en) 1980-09-16 1980-09-16 Display unit

Country Status (1)

Country Link
JP (1) JPS5752072A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002073706A1 (en) * 2001-03-09 2002-09-19 Sony Corporation Display apparatus and its manufacturing method
US6734030B2 (en) 2001-03-06 2004-05-11 Sony Corporation Semiconductor light emitting device and method of fabricating semiconductor light emitting device
US6828591B2 (en) 2000-12-15 2004-12-07 Sony Corporation Semiconductor light emitting device and fabrication method thereof
US6830946B2 (en) 2001-02-01 2004-12-14 Sony Corporation Device transfer method and panel
US6831300B2 (en) 2001-02-21 2004-12-14 Sony Corporation Semiconductor light emitting device, manufacturing method of a semiconductor light emitting device and connection structure of an electrode layer
US6870190B2 (en) 2001-03-06 2005-03-22 Sony Corporation Display unit and semiconductor light emitting device
US6924500B2 (en) 2000-07-18 2005-08-02 Sony Corporation Semiconductor light-emitting device and process for producing the same
JP2007506279A (en) * 2003-09-18 2007-03-15 クリー インコーポレイテッドCree Inc. Molded chip manufacturing method and apparatus
US7250320B2 (en) 2003-03-20 2007-07-31 Sony Corporation Semiconductor light emitting element, manufacturing method thereof, integrated semiconductor light emitting device, manufacturing method thereof, image display device, manufacturing method thereof, illuminating device and manufacturing method thereof
CN104364921A (en) * 2012-06-01 2015-02-18 欧司朗光电半导体有限公司 Optoelectronic module and method for producing an optoelectronic module
DE102018104290A1 (en) * 2018-02-26 2019-08-29 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7221001B2 (en) 2000-07-18 2007-05-22 Sony Corporation Semiconductor light-emitting device and process for producing the same
US6924500B2 (en) 2000-07-18 2005-08-02 Sony Corporation Semiconductor light-emitting device and process for producing the same
US6828591B2 (en) 2000-12-15 2004-12-07 Sony Corporation Semiconductor light emitting device and fabrication method thereof
US6921675B2 (en) 2001-02-01 2005-07-26 Sony Corporation Device transfer method and panel
US6830946B2 (en) 2001-02-01 2004-12-14 Sony Corporation Device transfer method and panel
US7233030B2 (en) 2001-02-01 2007-06-19 Sony Corporation Device transfer method and panel
US6831300B2 (en) 2001-02-21 2004-12-14 Sony Corporation Semiconductor light emitting device, manufacturing method of a semiconductor light emitting device and connection structure of an electrode layer
US6870190B2 (en) 2001-03-06 2005-03-22 Sony Corporation Display unit and semiconductor light emitting device
US6734030B2 (en) 2001-03-06 2004-05-11 Sony Corporation Semiconductor light emitting device and method of fabricating semiconductor light emitting device
JP2002270898A (en) * 2001-03-09 2002-09-20 Sony Corp Display device and its manufacturing method
US6773943B2 (en) * 2001-03-09 2004-08-10 Sony Corporation Display unit and method of fabricating the same
WO2002073706A1 (en) * 2001-03-09 2002-09-19 Sony Corporation Display apparatus and its manufacturing method
US7250320B2 (en) 2003-03-20 2007-07-31 Sony Corporation Semiconductor light emitting element, manufacturing method thereof, integrated semiconductor light emitting device, manufacturing method thereof, image display device, manufacturing method thereof, illuminating device and manufacturing method thereof
JP2007506279A (en) * 2003-09-18 2007-03-15 クリー インコーポレイテッドCree Inc. Molded chip manufacturing method and apparatus
CN104364921A (en) * 2012-06-01 2015-02-18 欧司朗光电半导体有限公司 Optoelectronic module and method for producing an optoelectronic module
JP2015518284A (en) * 2012-06-01 2015-06-25 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH Optoelectronic module and manufacturing method of optoelectronic module
CN104364921B (en) * 2012-06-01 2017-05-03 欧司朗光电半导体有限公司 Optoelectronic module and method for producing an optoelectronic module
DE102018104290A1 (en) * 2018-02-26 2019-08-29 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component

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