JPS5752072A - Display unit - Google Patents
Display unitInfo
- Publication number
- JPS5752072A JPS5752072A JP12718080A JP12718080A JPS5752072A JP S5752072 A JPS5752072 A JP S5752072A JP 12718080 A JP12718080 A JP 12718080A JP 12718080 A JP12718080 A JP 12718080A JP S5752072 A JPS5752072 A JP S5752072A
- Authority
- JP
- Japan
- Prior art keywords
- display unit
- display
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12718080A JPS5752072A (en) | 1980-09-16 | 1980-09-16 | Display unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12718080A JPS5752072A (en) | 1980-09-16 | 1980-09-16 | Display unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5752072A true JPS5752072A (en) | 1982-03-27 |
Family
ID=14953646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12718080A Pending JPS5752072A (en) | 1980-09-16 | 1980-09-16 | Display unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5752072A (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1152464A2 (en) * | 2000-04-28 | 2001-11-07 | Sony Corporation | Chip size package semiconductor device and method of manufacturing the same |
WO2002073706A1 (en) * | 2001-03-09 | 2002-09-19 | Sony Corporation | Display apparatus and its manufacturing method |
US6734030B2 (en) | 2001-03-06 | 2004-05-11 | Sony Corporation | Semiconductor light emitting device and method of fabricating semiconductor light emitting device |
US6828591B2 (en) | 2000-12-15 | 2004-12-07 | Sony Corporation | Semiconductor light emitting device and fabrication method thereof |
US6830946B2 (en) | 2001-02-01 | 2004-12-14 | Sony Corporation | Device transfer method and panel |
US6831300B2 (en) | 2001-02-21 | 2004-12-14 | Sony Corporation | Semiconductor light emitting device, manufacturing method of a semiconductor light emitting device and connection structure of an electrode layer |
US6870190B2 (en) | 2001-03-06 | 2005-03-22 | Sony Corporation | Display unit and semiconductor light emitting device |
US6924500B2 (en) | 2000-07-18 | 2005-08-02 | Sony Corporation | Semiconductor light-emitting device and process for producing the same |
JP2007506279A (en) * | 2003-09-18 | 2007-03-15 | クリー インコーポレイテッド | Molded chip manufacturing method and apparatus |
US7250320B2 (en) | 2003-03-20 | 2007-07-31 | Sony Corporation | Semiconductor light emitting element, manufacturing method thereof, integrated semiconductor light emitting device, manufacturing method thereof, image display device, manufacturing method thereof, illuminating device and manufacturing method thereof |
CN104364921A (en) * | 2012-06-01 | 2015-02-18 | 欧司朗光电半导体有限公司 | Optoelectronic module and method for producing an optoelectronic module |
DE102018104290A1 (en) * | 2018-02-26 | 2019-08-29 | Osram Opto Semiconductors Gmbh | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT |
DE102015112556B4 (en) | 2015-07-30 | 2024-03-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Video wall module and method for producing the same |
-
1980
- 1980-09-16 JP JP12718080A patent/JPS5752072A/en active Pending
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1152464A2 (en) * | 2000-04-28 | 2001-11-07 | Sony Corporation | Chip size package semiconductor device and method of manufacturing the same |
US7221001B2 (en) | 2000-07-18 | 2007-05-22 | Sony Corporation | Semiconductor light-emitting device and process for producing the same |
US6924500B2 (en) | 2000-07-18 | 2005-08-02 | Sony Corporation | Semiconductor light-emitting device and process for producing the same |
US6828591B2 (en) | 2000-12-15 | 2004-12-07 | Sony Corporation | Semiconductor light emitting device and fabrication method thereof |
US7233030B2 (en) | 2001-02-01 | 2007-06-19 | Sony Corporation | Device transfer method and panel |
US6830946B2 (en) | 2001-02-01 | 2004-12-14 | Sony Corporation | Device transfer method and panel |
US6921675B2 (en) | 2001-02-01 | 2005-07-26 | Sony Corporation | Device transfer method and panel |
US6831300B2 (en) | 2001-02-21 | 2004-12-14 | Sony Corporation | Semiconductor light emitting device, manufacturing method of a semiconductor light emitting device and connection structure of an electrode layer |
US6734030B2 (en) | 2001-03-06 | 2004-05-11 | Sony Corporation | Semiconductor light emitting device and method of fabricating semiconductor light emitting device |
US6870190B2 (en) | 2001-03-06 | 2005-03-22 | Sony Corporation | Display unit and semiconductor light emitting device |
WO2002073706A1 (en) * | 2001-03-09 | 2002-09-19 | Sony Corporation | Display apparatus and its manufacturing method |
US6773943B2 (en) * | 2001-03-09 | 2004-08-10 | Sony Corporation | Display unit and method of fabricating the same |
JP2002270898A (en) * | 2001-03-09 | 2002-09-20 | Sony Corp | Display device and its manufacturing method |
CN100358153C (en) * | 2001-03-09 | 2007-12-26 | 索尼公司 | Display device and its manufacturing method |
US7250320B2 (en) | 2003-03-20 | 2007-07-31 | Sony Corporation | Semiconductor light emitting element, manufacturing method thereof, integrated semiconductor light emitting device, manufacturing method thereof, image display device, manufacturing method thereof, illuminating device and manufacturing method thereof |
JP2007506279A (en) * | 2003-09-18 | 2007-03-15 | クリー インコーポレイテッド | Molded chip manufacturing method and apparatus |
CN104364921A (en) * | 2012-06-01 | 2015-02-18 | 欧司朗光电半导体有限公司 | Optoelectronic module and method for producing an optoelectronic module |
JP2015518284A (en) * | 2012-06-01 | 2015-06-25 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | Optoelectronic module and manufacturing method of optoelectronic module |
CN104364921B (en) * | 2012-06-01 | 2017-05-03 | 欧司朗光电半导体有限公司 | Optoelectronic module and method for producing an optoelectronic module |
EP2856523B1 (en) * | 2012-06-01 | 2020-09-02 | OSRAM Opto Semiconductors GmbH | Method for producing an optoelectronic module |
DE102015112556B4 (en) | 2015-07-30 | 2024-03-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Video wall module and method for producing the same |
DE102018104290A1 (en) * | 2018-02-26 | 2019-08-29 | Osram Opto Semiconductors Gmbh | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT |
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