JPS5752000B2 - - Google Patents

Info

Publication number
JPS5752000B2
JPS5752000B2 JP53134643A JP13464378A JPS5752000B2 JP S5752000 B2 JPS5752000 B2 JP S5752000B2 JP 53134643 A JP53134643 A JP 53134643A JP 13464378 A JP13464378 A JP 13464378A JP S5752000 B2 JPS5752000 B2 JP S5752000B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53134643A
Other versions
JPS5494660A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5494660A publication Critical patent/JPS5494660A/ja
Publication of JPS5752000B2 publication Critical patent/JPS5752000B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP13464378A 1977-12-30 1978-11-02 Apparatus for packaging electronic devices Granted JPS5494660A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/866,193 US4149218A (en) 1977-12-30 1977-12-30 Minimum delay module assembly

Publications (2)

Publication Number Publication Date
JPS5494660A JPS5494660A (en) 1979-07-26
JPS5752000B2 true JPS5752000B2 (ja) 1982-11-05

Family

ID=25347116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13464378A Granted JPS5494660A (en) 1977-12-30 1978-11-02 Apparatus for packaging electronic devices

Country Status (5)

Country Link
US (1) US4149218A (ja)
JP (1) JPS5494660A (ja)
DE (1) DE2855725A1 (ja)
FR (1) FR2413846A1 (ja)
GB (1) GB2011728B (ja)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5835398B2 (ja) * 1979-05-28 1983-08-02 富士通株式会社 自然空冷式プリント板縦置型架装置
DE7917450U1 (de) * 1979-06-18 1979-09-20 Siemens Ag, 1000 Berlin Und 8000 Muenchen Tragbares koffergeraet zur pruefung von datenfernverarbeitungssystemen
JPS57132497U (ja) * 1981-02-10 1982-08-18
EP0105060B1 (en) * 1982-09-29 1988-06-01 International Business Machines Corporation Electronic assembly with forced convection cooling
US4502099A (en) * 1983-05-27 1985-02-26 Storage Technology Partners Ii Printed circuit card air cooling system
US4750087A (en) * 1984-03-26 1988-06-07 The Boeing Company Ventilated instrument panel support rail
DE3617622A1 (de) * 1986-05-26 1987-12-03 Siemens Ag Trag- und aufstellvorrichtung fuer elektrische geraete in quaderfoermigen gehaeusen
IT1218104B (it) * 1986-06-27 1990-04-12 Sgs Microelettronica Spa Metodo di progettazione di microcalcolatori integrati e microcalcolatore integrato a struttura modulare ottenuto con il metodo suddetto
US5440450A (en) * 1990-09-14 1995-08-08 Next, Inc. Housing cooling system
JP2934493B2 (ja) * 1990-10-24 1999-08-16 株式会社日立製作所 電子機器の冷却装置
DE9104384U1 (de) * 1991-04-10 1991-06-06 Siemens AG, 8000 München Elektronisches Baugruppensystem
US5207613A (en) * 1991-07-08 1993-05-04 Tandem Computers Incorporated Method and apparatus for mounting, cooling, interconnecting, and providing power and data to a plurality of electronic modules
US5237484A (en) * 1991-07-08 1993-08-17 Tandem Computers Incorporated Apparatus for cooling a plurality of electronic modules
US5398159A (en) * 1992-12-15 1995-03-14 Telefonaktiebolaget Lm Ericsson Modular packaging system
JP2658805B2 (ja) * 1993-06-30 1997-09-30 日本電気株式会社 電磁シールド用筐体
US5446619A (en) * 1993-08-12 1995-08-29 Compaq Computer Corp. Card extender unit for computer
US5469037A (en) * 1994-06-02 1995-11-21 Encore Computer Corporation Linear accelerated device
US5528454A (en) * 1994-12-29 1996-06-18 Compuserve Incorporated Cooling device for electronic components arranged in a vertical series and vertical series of electronic devices containing same
US5592364A (en) * 1995-01-24 1997-01-07 Staktek Corporation High density integrated circuit module with complex electrical interconnect rails
US5963424A (en) * 1995-11-07 1999-10-05 Sun Microsystems, Inc. Pulsar desk top system that will produce 500 watts of heat
RU2133084C1 (ru) * 1996-05-05 1999-07-10 Дагестанский государственный технический университет Термоэлектрическое полупроводниковое устройство для отвода теплоты и термостабилизации микросборок
RU2133560C1 (ru) * 1996-06-06 1999-07-20 Дагестанский государственный технический университет Термоэлектрический интенсификатор теплопередачи преимущественно для отвода тепла от импульсных источников и элементов радиоэлектроники большой мощности
TW313277U (en) * 1996-07-19 1997-08-11 Mitac Int Corp Transmission interface bridge device
DE19719507A1 (de) * 1997-05-09 1998-11-12 Alsthom Cge Alcatel Gestellrahmen mit Baugruppenträger und Belüftungseinrichtung
US6011688A (en) * 1997-06-04 2000-01-04 Hewlett Packard Co. Compact apparatus for cooling a plurality of circuit packs arranged with a cage
US6272016B1 (en) * 2000-05-31 2001-08-07 Trw Inc Avionics rack with external electronics module
RU2198419C1 (ru) * 2001-11-05 2003-02-10 Дагестанский государственный технический университет Устройство для охлаждения электронных плат
US6603662B1 (en) * 2002-01-25 2003-08-05 Sun Microsystems, Inc. Computer cooling system
GB2399950B (en) * 2003-03-22 2005-08-10 Motorola Inc Constructions for housing electronic equipment
RU2257606C2 (ru) * 2003-05-12 2005-07-27 Дагестанский государственный технический университет (ДГТУ) Устройство для отвода тепла от элементов радиоэлектронной аппаратуры с повторно-кратковременными тепловыделениями
RU2288555C2 (ru) * 2003-08-04 2006-11-27 Дагестанский государственный технический университет (ДГТУ) Термоэлектрический теплоотвод
RU2341922C2 (ru) * 2005-10-20 2008-12-20 Владимир Миронович Вишневский Устройство для температурной стабилизации электронных блоков
US7542288B2 (en) * 2007-05-16 2009-06-02 Emerson Network Power - Embedded Computing, Inc. Skewed cardcage orientation for increasing cooling in a chassis
US10178444B2 (en) * 2015-04-15 2019-01-08 Coriant Oy Device-frame for telecommunication devices
CN119594091A (zh) * 2023-09-11 2025-03-11 广东美的制冷设备有限公司 连接部件、壳体组件及空气处理机组

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147403A (en) * 1962-10-10 1964-09-01 Philco Corp Cooling system for electronic apparatus
US3874444A (en) * 1973-12-03 1975-04-01 Gte Automatic Electric Lab Inc Duo-baffle air separator apparatus
US3956673A (en) * 1974-02-14 1976-05-11 Lockheed Aircraft Corporation Printed circuit modules cooled by rack with forced air
JPS5441309Y2 (ja) * 1974-11-28 1979-12-04
US3967874A (en) * 1975-09-30 1976-07-06 Calabro Anthony Denis Uniformly cooled printed circuit board mounting assembly

Also Published As

Publication number Publication date
GB2011728A (en) 1979-07-11
FR2413846B1 (ja) 1982-06-04
GB2011728B (en) 1982-06-16
US4149218A (en) 1979-04-10
DE2855725A1 (de) 1979-07-12
JPS5494660A (en) 1979-07-26
FR2413846A1 (fr) 1979-07-27

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