JPS5751730B2 - - Google Patents
Info
- Publication number
- JPS5751730B2 JPS5751730B2 JP49080856A JP8085674A JPS5751730B2 JP S5751730 B2 JPS5751730 B2 JP S5751730B2 JP 49080856 A JP49080856 A JP 49080856A JP 8085674 A JP8085674 A JP 8085674A JP S5751730 B2 JPS5751730 B2 JP S5751730B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49080856A JPS5751730B2 (en:Method) | 1974-07-15 | 1974-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49080856A JPS5751730B2 (en:Method) | 1974-07-15 | 1974-07-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS519682A JPS519682A (en:Method) | 1976-01-26 |
| JPS5751730B2 true JPS5751730B2 (en:Method) | 1982-11-04 |
Family
ID=13729975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49080856A Expired JPS5751730B2 (en:Method) | 1974-07-15 | 1974-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5751730B2 (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5927732B2 (ja) * | 1976-08-05 | 1984-07-07 | 大平洋金属株式会社 | 溶融スラグからの熱回収方法 |
| JPS55133085A (en) * | 1979-04-03 | 1980-10-16 | Matsushita Electric Industrial Co Ltd | Display unit |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128498B2 (en:Method) * | 1972-02-07 | 1976-08-19 | ||
| JPS4947586A (en:Method) * | 1972-09-12 | 1974-05-08 | ||
| JPS5744768B2 (en:Method) * | 1973-05-25 | 1982-09-24 |
-
1974
- 1974-07-15 JP JP49080856A patent/JPS5751730B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS519682A (en:Method) | 1976-01-26 |