JPS5128498B2 - - Google Patents
Info
- Publication number
- JPS5128498B2 JPS5128498B2 JP47013742A JP1374272A JPS5128498B2 JP S5128498 B2 JPS5128498 B2 JP S5128498B2 JP 47013742 A JP47013742 A JP 47013742A JP 1374272 A JP1374272 A JP 1374272A JP S5128498 B2 JPS5128498 B2 JP S5128498B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47013742A JPS5128498B2 (en:Method) | 1972-02-07 | 1972-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47013742A JPS5128498B2 (en:Method) | 1972-02-07 | 1972-02-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4883779A JPS4883779A (en:Method) | 1973-11-08 |
| JPS5128498B2 true JPS5128498B2 (en:Method) | 1976-08-19 |
Family
ID=11841699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47013742A Expired JPS5128498B2 (en:Method) | 1972-02-07 | 1972-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5128498B2 (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6265001U (en:Method) * | 1985-10-12 | 1987-04-22 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5751730B2 (en:Method) * | 1974-07-15 | 1982-11-04 | ||
| JPS5394074U (en:Method) * | 1976-12-28 | 1978-08-01 | ||
| JPS5412365U (en:Method) * | 1977-06-27 | 1979-01-26 | ||
| EP0023534A3 (en) * | 1979-08-06 | 1982-04-28 | Teccor Electronics, Inc. | Semiconductor device mounting structure and method of mounting |
| JP2011032336A (ja) * | 2009-07-31 | 2011-02-17 | Kansai Paint Co Ltd | プルラン誘導体及び有機溶剤型塗料組成物 |
-
1972
- 1972-02-07 JP JP47013742A patent/JPS5128498B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6265001U (en:Method) * | 1985-10-12 | 1987-04-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4883779A (en:Method) | 1973-11-08 |