JPS57501922A - - Google Patents

Info

Publication number
JPS57501922A
JPS57501922A JP57500118A JP50011882A JPS57501922A JP S57501922 A JPS57501922 A JP S57501922A JP 57500118 A JP57500118 A JP 57500118A JP 50011882 A JP50011882 A JP 50011882A JP S57501922 A JPS57501922 A JP S57501922A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57500118A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS57501922A publication Critical patent/JPS57501922A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP57500118A 1980-12-09 1981-12-09 Pending JPS57501922A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8008634A SE441530B (sv) 1980-12-09 1980-12-09 Sett och bad for att utfora stromlos forkoppring

Publications (1)

Publication Number Publication Date
JPS57501922A true JPS57501922A (ja) 1982-10-28

Family

ID=20342425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57500118A Pending JPS57501922A (ja) 1980-12-09 1981-12-09

Country Status (6)

Country Link
US (1) US4520052A (ja)
JP (1) JPS57501922A (ja)
DE (1) DE3152613T1 (ja)
GB (1) GB2100758B (ja)
SE (1) SE441530B (ja)
WO (1) WO1982002063A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5545430A (en) * 1994-12-02 1996-08-13 Motorola, Inc. Method and reduction solution for metallizing a surface
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
US8393226B2 (en) * 2010-07-29 2013-03-12 Nsk Ltd. Inclusion rating method
KR102428185B1 (ko) 2016-05-04 2022-08-01 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 기판의 표면 상에 대한 금속 또는 금속 합금의 활성화를 포함하는 이의 전착 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE316345B (ja) * 1963-06-18 1969-10-20 Photocircuits Corp
US3310430A (en) * 1965-06-30 1967-03-21 Day Company Electroless copper plating
AT289498B (de) * 1966-02-01 1971-04-26 Photocircuits Corp Bad zum Abscheiden von Kupferüberzügen ohne Stromzufuhr von außen
US3329512A (en) * 1966-04-04 1967-07-04 Shipley Co Chemical deposition of copper and solutions therefor
FR2066188A5 (en) * 1969-10-20 1971-08-06 Pmd Chemicals Ltd Chemical copper plating using tertiary - amine promoters
JPS55464B1 (ja) * 1971-07-02 1980-01-08
US3720525A (en) * 1971-08-16 1973-03-13 Rca Corp Electroless copper plating solutions with accelerated plating rates
US3748166A (en) * 1972-09-06 1973-07-24 Crown City Plating Co Electroless plating process employing solutions stabilized with sulfamic acid and salts thereof
NL171176C (nl) * 1972-10-05 1983-02-16 Philips Nv Bad voor het stroomloos afzetten van buigbaar koper.
US4036651A (en) * 1974-02-26 1977-07-19 Rca Corporation Electroless copper plating bath
US4171225A (en) * 1976-01-23 1979-10-16 U.S. Philips Corporation Electroless copper plating solutions
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution

Also Published As

Publication number Publication date
WO1982002063A1 (en) 1982-06-24
DE3152613C2 (ja) 1990-01-25
GB2100758A (en) 1983-01-06
SE441530B (sv) 1985-10-14
GB2100758B (en) 1985-10-02
DE3152613T1 (de) 1983-09-08
SE8008634L (sv) 1982-06-10
US4520052A (en) 1985-05-28

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