JPS5747028U - - Google Patents
Info
- Publication number
- JPS5747028U JPS5747028U JP12360880U JP12360880U JPS5747028U JP S5747028 U JPS5747028 U JP S5747028U JP 12360880 U JP12360880 U JP 12360880U JP 12360880 U JP12360880 U JP 12360880U JP S5747028 U JPS5747028 U JP S5747028U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12360880U JPS5747028U (enExample) | 1980-08-29 | 1980-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12360880U JPS5747028U (enExample) | 1980-08-29 | 1980-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5747028U true JPS5747028U (enExample) | 1982-03-16 |
Family
ID=29484174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12360880U Pending JPS5747028U (enExample) | 1980-08-29 | 1980-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5747028U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60113437A (ja) * | 1983-11-24 | 1985-06-19 | Hitachi Ltd | 樹脂封止用金型 |
| JP2010114335A (ja) * | 2008-11-10 | 2010-05-20 | Fujitsu Microelectronics Ltd | 樹脂封止方法 |
-
1980
- 1980-08-29 JP JP12360880U patent/JPS5747028U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60113437A (ja) * | 1983-11-24 | 1985-06-19 | Hitachi Ltd | 樹脂封止用金型 |
| JP2010114335A (ja) * | 2008-11-10 | 2010-05-20 | Fujitsu Microelectronics Ltd | 樹脂封止方法 |