JPS5746875A - Production of laminate - Google Patents

Production of laminate

Info

Publication number
JPS5746875A
JPS5746875A JP55121958A JP12195880A JPS5746875A JP S5746875 A JPS5746875 A JP S5746875A JP 55121958 A JP55121958 A JP 55121958A JP 12195880 A JP12195880 A JP 12195880A JP S5746875 A JPS5746875 A JP S5746875A
Authority
JP
Japan
Prior art keywords
laminate
metallic plates
resin
mold
prepregs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55121958A
Other languages
Japanese (ja)
Inventor
Kazuhito Yasuzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP55121958A priority Critical patent/JPS5746875A/en
Publication of JPS5746875A publication Critical patent/JPS5746875A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE: To efficiently obtain a laminate having an enhanced surface smoothness while preventing the penetration of foreign matters, by a method wherein the surfaces of metallic plates for mold are covered with a material intended to become the outermost layer when lamination-molding a stack of prepregs by thermocompression using the metallic plates for mold.
CONSTITUTION: A resin for laminate such as an epoxy resin, a phenolic resin or the like is impregnated in a base material for laminate (e.g., kraft paper) selected from the group consisting of a (non-)woven fabric, a mat and the like of natural fibers, organic synthetic fibers or inorganic fibers, followed by drying to obtain the prepreg 1 having a predetermined resin content. The stack a of a required number of the prepregs 1 is held between the metallic plates 2 for mold which are covered with the material 4 (e.g., the prepreg itself, a copper foil in the case of double-face copper cladding, etc.) intended to become the outermost layer of the laminate, and the lamination molding is carried out by applying a pressure while heating (e.g., 160°C, 100kg/cm2, 60min).
EFFECT: No contamination of the metallic plates due to outflow of molten resin 3, and no need for deburring.
COPYRIGHT: (C)1982,JPO&Japio
JP55121958A 1980-09-02 1980-09-02 Production of laminate Pending JPS5746875A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55121958A JPS5746875A (en) 1980-09-02 1980-09-02 Production of laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55121958A JPS5746875A (en) 1980-09-02 1980-09-02 Production of laminate

Publications (1)

Publication Number Publication Date
JPS5746875A true JPS5746875A (en) 1982-03-17

Family

ID=14824109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55121958A Pending JPS5746875A (en) 1980-09-02 1980-09-02 Production of laminate

Country Status (1)

Country Link
JP (1) JPS5746875A (en)

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