JPS5739435U - - Google Patents
Info
- Publication number
- JPS5739435U JPS5739435U JP1980117356U JP11735680U JPS5739435U JP S5739435 U JPS5739435 U JP S5739435U JP 1980117356 U JP1980117356 U JP 1980117356U JP 11735680 U JP11735680 U JP 11735680U JP S5739435 U JPS5739435 U JP S5739435U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5363—
-
- H10W72/59—
-
- H10W72/932—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980117356U JPS5739435U (enExample) | 1980-08-19 | 1980-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980117356U JPS5739435U (enExample) | 1980-08-19 | 1980-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5739435U true JPS5739435U (enExample) | 1982-03-03 |
Family
ID=29478140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980117356U Pending JPS5739435U (enExample) | 1980-08-19 | 1980-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5739435U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01137995U (enExample) * | 1988-03-11 | 1989-09-20 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5378768A (en) * | 1976-12-23 | 1978-07-12 | Toshiba Corp | Wire bonding method of semiconductor element |
-
1980
- 1980-08-19 JP JP1980117356U patent/JPS5739435U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5378768A (en) * | 1976-12-23 | 1978-07-12 | Toshiba Corp | Wire bonding method of semiconductor element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01137995U (enExample) * | 1988-03-11 | 1989-09-20 |