JPS5736851A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS5736851A JPS5736851A JP11172180A JP11172180A JPS5736851A JP S5736851 A JPS5736851 A JP S5736851A JP 11172180 A JP11172180 A JP 11172180A JP 11172180 A JP11172180 A JP 11172180A JP S5736851 A JPS5736851 A JP S5736851A
- Authority
- JP
- Japan
- Prior art keywords
- tabs
- lead
- lead frame
- frame
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To align tabs along the longitudinal direction of a lead frame on the same line by extending at the tabs in the desired length in the direction of the width of the lead frame. CONSTITUTION:The outer leads 10 of a lead pattern 1 are so arranged as to be engaged with the outer leads 10 of the adjacent lead patterns 1 to be displaced toward the width of the lead frame by 1/2 of a lead pitch a with each other, every other tabs are disposed on the same line as the tabs 3 of the adjacent lead pattern 1 by extending in the width direction of the lead frame 11 by a/2, and the one edges of the tabs facing with the tabs extend in the outer frame direction by a/6. The tabs 3 of every other lead patterns except the previous lead patterns extend by 2a/3, and are aligned in one row along the longitudinal direction of the lead frame 11 and the tabs. In this manner, the bonding workability can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11172180A JPS5736851A (en) | 1980-08-15 | 1980-08-15 | Lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11172180A JPS5736851A (en) | 1980-08-15 | 1980-08-15 | Lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5736851A true JPS5736851A (en) | 1982-02-27 |
Family
ID=14568474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11172180A Pending JPS5736851A (en) | 1980-08-15 | 1980-08-15 | Lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5736851A (en) |
-
1980
- 1980-08-15 JP JP11172180A patent/JPS5736851A/en active Pending
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