JPS5735277B2 - - Google Patents
Info
- Publication number
- JPS5735277B2 JPS5735277B2 JP5030279A JP5030279A JPS5735277B2 JP S5735277 B2 JPS5735277 B2 JP S5735277B2 JP 5030279 A JP5030279 A JP 5030279A JP 5030279 A JP5030279 A JP 5030279A JP S5735277 B2 JPS5735277 B2 JP S5735277B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5030279A JPS55145199A (en) | 1979-04-25 | 1979-04-25 | Shielding board for plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5030279A JPS55145199A (en) | 1979-04-25 | 1979-04-25 | Shielding board for plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55145199A JPS55145199A (en) | 1980-11-12 |
| JPS5735277B2 true JPS5735277B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1982-07-28 |
Family
ID=12855093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5030279A Granted JPS55145199A (en) | 1979-04-25 | 1979-04-25 | Shielding board for plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55145199A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02138177U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-04-21 | 1990-11-19 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE9007542U1 (de) * | 1990-02-20 | 1992-06-25 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | Vorrichtung zum Abblenden von Feldlinien in einer Galvanikanlage |
| DE4106733A1 (de) * | 1991-03-02 | 1992-09-03 | Schering Ag | Vorrichtung zum abblenden von feldlinien in einer galvanikanlage (iii) |
| GB2330151A (en) * | 1997-10-07 | 1999-04-14 | Process Automation Internation | An electroplating apparatus with movable diaphragms |
| JP4994185B2 (ja) * | 2007-10-24 | 2012-08-08 | 株式会社 大昌電子 | めっき電流遮蔽体、めっき用治具、めっき装置、めっき基板の製造方法 |
-
1979
- 1979-04-25 JP JP5030279A patent/JPS55145199A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02138177U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-04-21 | 1990-11-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55145199A (en) | 1980-11-12 |