Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP2645976ApriorityCriticalpatent/JPS52109869A/ja
Publication of JPS52109869ApublicationCriticalpatent/JPS52109869A/ja
Publication of JPS5733852B2publicationCriticalpatent/JPS5733852B2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/42—Wire connectors; Manufacturing methods related thereto
H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
H01L2224/491—Disposition
H01L2224/4912—Layout
H01L2224/49171—Fan-out arrangements
Landscapes
Wire Bonding
(AREA)
JP2645976A1976-03-111976-03-11Apparatus for wireebonding
GrantedJPS52109869A
(en)