JPS5733852B2 - - Google Patents
Info
- Publication number
- JPS5733852B2 JPS5733852B2 JP2645976A JP2645976A JPS5733852B2 JP S5733852 B2 JPS5733852 B2 JP S5733852B2 JP 2645976 A JP2645976 A JP 2645976A JP 2645976 A JP2645976 A JP 2645976A JP S5733852 B2 JPS5733852 B2 JP S5733852B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2645976A JPS52109869A (en) | 1976-03-11 | 1976-03-11 | Apparatus for wireebonding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2645976A JPS52109869A (en) | 1976-03-11 | 1976-03-11 | Apparatus for wireebonding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52109869A JPS52109869A (en) | 1977-09-14 |
JPS5733852B2 true JPS5733852B2 (ja) | 1982-07-20 |
Family
ID=12194081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2645976A Granted JPS52109869A (en) | 1976-03-11 | 1976-03-11 | Apparatus for wireebonding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52109869A (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50157069A (ja) * | 1974-06-07 | 1975-12-18 |
-
1976
- 1976-03-11 JP JP2645976A patent/JPS52109869A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50157069A (ja) * | 1974-06-07 | 1975-12-18 |
Also Published As
Publication number | Publication date |
---|---|
JPS52109869A (en) | 1977-09-14 |