JPS5731298B2 - - Google Patents

Info

Publication number
JPS5731298B2
JPS5731298B2 JP4595474A JP4595474A JPS5731298B2 JP S5731298 B2 JPS5731298 B2 JP S5731298B2 JP 4595474 A JP4595474 A JP 4595474A JP 4595474 A JP4595474 A JP 4595474A JP S5731298 B2 JPS5731298 B2 JP S5731298B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4595474A
Other languages
Japanese (ja)
Other versions
JPS50139671A (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4595474A priority Critical patent/JPS5731298B2/ja
Publication of JPS50139671A publication Critical patent/JPS50139671A/ja
Publication of JPS5731298B2 publication Critical patent/JPS5731298B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP4595474A 1974-04-25 1974-04-25 Expired JPS5731298B2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4595474A JPS5731298B2 (enrdf_load_html_response) 1974-04-25 1974-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4595474A JPS5731298B2 (enrdf_load_html_response) 1974-04-25 1974-04-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP17605781A Division JPS57103342A (en) 1981-11-02 1981-11-02 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS50139671A JPS50139671A (enrdf_load_html_response) 1975-11-08
JPS5731298B2 true JPS5731298B2 (enrdf_load_html_response) 1982-07-03

Family

ID=12733659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4595474A Expired JPS5731298B2 (enrdf_load_html_response) 1974-04-25 1974-04-25

Country Status (1)

Country Link
JP (1) JPS5731298B2 (enrdf_load_html_response)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143835A (en) * 1981-02-27 1982-09-06 Citizen Watch Co Ltd Mounting method of ic
JPS63291445A (ja) * 1987-05-23 1988-11-29 Fuji Plant Kogyo Kk リ−ドフレ−ムへの２色部分メッキ方法
KR0165883B1 (ko) * 1988-09-16 1999-02-01 존 엠. 클락 테이프 자동화 본딩 프로세스용의 금/주석 공정 본딩

Also Published As

Publication number Publication date
JPS50139671A (enrdf_load_html_response) 1975-11-08

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