JPS5731297B2 - - Google Patents

Info

Publication number
JPS5731297B2
JPS5731297B2 JP9905575A JP9905575A JPS5731297B2 JP S5731297 B2 JPS5731297 B2 JP S5731297B2 JP 9905575 A JP9905575 A JP 9905575A JP 9905575 A JP9905575 A JP 9905575A JP S5731297 B2 JPS5731297 B2 JP S5731297B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9905575A
Other languages
Japanese (ja)
Other versions
JPS5148276A (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5148276A publication Critical patent/JPS5148276A/ja
Publication of JPS5731297B2 publication Critical patent/JPS5731297B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49915—Overedge assembling of seated part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49925—Inward deformation of aperture or hollow body wall
    • Y10T29/49934—Inward deformation of aperture or hollow body wall by axially applying force
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/49—Member deformed in situ
    • Y10T403/4991—Both members deformed

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP9905575A 1974-10-03 1975-08-14 Expired JPS5731297B2 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US511939A US3918625A (en) 1974-10-03 1974-10-03 Method of making a double extruded semiconductor joint

Publications (2)

Publication Number Publication Date
JPS5148276A JPS5148276A (cg-RX-API-DMAC10.html) 1976-04-24
JPS5731297B2 true JPS5731297B2 (cg-RX-API-DMAC10.html) 1982-07-03

Family

ID=24037049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9905575A Expired JPS5731297B2 (cg-RX-API-DMAC10.html) 1974-10-03 1975-08-14

Country Status (11)

Country Link
US (1) US3918625A (cg-RX-API-DMAC10.html)
JP (1) JPS5731297B2 (cg-RX-API-DMAC10.html)
CA (1) CA1027259A (cg-RX-API-DMAC10.html)
CH (1) CH590559A5 (cg-RX-API-DMAC10.html)
DE (1) DE2529789C3 (cg-RX-API-DMAC10.html)
DK (1) DK445375A (cg-RX-API-DMAC10.html)
FR (1) FR2287106A1 (cg-RX-API-DMAC10.html)
GB (1) GB1525122A (cg-RX-API-DMAC10.html)
IT (1) IT1036425B (cg-RX-API-DMAC10.html)
NL (1) NL176413C (cg-RX-API-DMAC10.html)
SE (1) SE408352B (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4192063A (en) * 1975-12-10 1980-03-11 Yoshio Sato Method for manufacturing a base of a semi-conductor device
US4049185A (en) * 1977-03-11 1977-09-20 The Nippert Company Method of forming double extruded mount
US4624303A (en) * 1985-04-29 1986-11-25 The Nippert Company Heat sink mounting and method of making
US4985978A (en) * 1988-03-01 1991-01-22 Textron Inc. Method for assembling a self-clinching fastening structure
US6453558B1 (en) * 2001-04-06 2002-09-24 Arvinmeritor, Inc. Method of locking together exhaust components
US7247564B2 (en) * 2004-06-28 2007-07-24 Hewlett-Packard Development Company, L.P. Electronic device
US10446351B2 (en) * 2017-06-06 2019-10-15 Littelfuse, Inc. Electrical contact assembly

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2419469A (en) * 1943-04-24 1947-04-22 Gen Electric Manufacturing method for electrical contacts
US3042428A (en) * 1954-04-05 1962-07-03 Gen Electric Copper-aluminum tubular connector
US3191268A (en) * 1958-02-28 1965-06-29 Gen Motors Corp Process for encapsulating transistors
NL120008C (cg-RX-API-DMAC10.html) * 1959-05-15
NL270996A (cg-RX-API-DMAC10.html) * 1960-11-09
US3198874A (en) * 1961-01-23 1965-08-03 Standard Pressed Steel Co Semi-conductor housings and method of making the same
US3197843A (en) * 1961-05-19 1965-08-03 Nippert Electric Products Comp Method of forming a mount for semiconductors
NL142278B (nl) * 1964-06-20 1974-05-15 Philips Nv Werkwijze voor het vervaardigen van een bodem van een voor een halfgeleidende inrichting bestemde omhulling en bodem, vervaardigd volgens deze werkwijze.
NL7115486A (cg-RX-API-DMAC10.html) * 1970-11-16 1972-05-18

Also Published As

Publication number Publication date
NL176413B (nl) 1984-11-01
SE7506919L (sv) 1976-04-05
DK445375A (da) 1976-04-04
CA1027259A (en) 1978-02-28
SE408352B (sv) 1979-06-05
NL7510492A (nl) 1976-04-06
DE2529789B2 (de) 1980-07-03
DE2529789A1 (de) 1976-04-15
JPS5148276A (cg-RX-API-DMAC10.html) 1976-04-24
US3918625A (en) 1975-11-11
GB1525122A (en) 1978-09-20
DE2529789C3 (de) 1981-12-10
CH590559A5 (cg-RX-API-DMAC10.html) 1977-08-15
FR2287106A1 (fr) 1976-04-30
IT1036425B (it) 1979-10-30
FR2287106B1 (cg-RX-API-DMAC10.html) 1982-05-28
NL176413C (nl) 1985-04-01

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