JPS5730309B2 - - Google Patents

Info

Publication number
JPS5730309B2
JPS5730309B2 JP15469176A JP15469176A JPS5730309B2 JP S5730309 B2 JPS5730309 B2 JP S5730309B2 JP 15469176 A JP15469176 A JP 15469176A JP 15469176 A JP15469176 A JP 15469176A JP S5730309 B2 JPS5730309 B2 JP S5730309B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15469176A
Other languages
Japanese (ja)
Other versions
JPS5378185A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15469176A priority Critical patent/JPS5378185A/ja
Publication of JPS5378185A publication Critical patent/JPS5378185A/ja
Publication of JPS5730309B2 publication Critical patent/JPS5730309B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Logic Circuits (AREA)
JP15469176A 1976-12-22 1976-12-22 Integrated circuit logical element Granted JPS5378185A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15469176A JPS5378185A (en) 1976-12-22 1976-12-22 Integrated circuit logical element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15469176A JPS5378185A (en) 1976-12-22 1976-12-22 Integrated circuit logical element

Publications (2)

Publication Number Publication Date
JPS5378185A JPS5378185A (en) 1978-07-11
JPS5730309B2 true JPS5730309B2 (sv) 1982-06-28

Family

ID=15589817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15469176A Granted JPS5378185A (en) 1976-12-22 1976-12-22 Integrated circuit logical element

Country Status (1)

Country Link
JP (1) JPS5378185A (sv)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58104306U (ja) * 1982-01-11 1983-07-15 富士バルブ株式会社 内燃機関用油圧アジヤスタ

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55107335A (en) * 1979-02-09 1980-08-18 Toshiba Corp Semiconductor integrated circuit
JPS59145542A (ja) * 1983-02-09 1984-08-21 Matsushita Electronics Corp 大規模集積回路
US4731643A (en) * 1985-10-21 1988-03-15 International Business Machines Corporation Logic-circuit layout for large-scale integrated circuits
US4746966A (en) * 1985-10-21 1988-05-24 International Business Machines Corporation Logic-circuit layout for large-scale integrated circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58104306U (ja) * 1982-01-11 1983-07-15 富士バルブ株式会社 内燃機関用油圧アジヤスタ

Also Published As

Publication number Publication date
JPS5378185A (en) 1978-07-11

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