JPS5730301B2 - - Google Patents

Info

Publication number
JPS5730301B2
JPS5730301B2 JP5895874A JP5895874A JPS5730301B2 JP S5730301 B2 JPS5730301 B2 JP S5730301B2 JP 5895874 A JP5895874 A JP 5895874A JP 5895874 A JP5895874 A JP 5895874A JP S5730301 B2 JPS5730301 B2 JP S5730301B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5895874A
Other languages
Japanese (ja)
Other versions
JPS50151470A (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5895874A priority Critical patent/JPS5730301B2/ja
Priority to US05/506,872 priority patent/US3946428A/en
Priority to FR7431590A priority patent/FR2244264B1/fr
Publication of JPS50151470A publication Critical patent/JPS50151470A/ja
Publication of JPS5730301B2 publication Critical patent/JPS5730301B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Wire Bonding (AREA)
JP5895874A 1973-09-19 1974-05-24 Expired JPS5730301B2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP5895874A JPS5730301B2 (fr) 1974-05-24 1974-05-24
US05/506,872 US3946428A (en) 1973-09-19 1974-09-17 Encapsulation package for a semiconductor element
FR7431590A FR2244264B1 (fr) 1973-09-19 1974-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5895874A JPS5730301B2 (fr) 1974-05-24 1974-05-24

Publications (2)

Publication Number Publication Date
JPS50151470A JPS50151470A (fr) 1975-12-05
JPS5730301B2 true JPS5730301B2 (fr) 1982-06-28

Family

ID=13099338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5895874A Expired JPS5730301B2 (fr) 1973-09-19 1974-05-24

Country Status (1)

Country Link
JP (1) JPS5730301B2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5979501U (ja) * 1982-11-18 1984-05-29 いすゞ自動車株式会社 排気タ−ビン過給機
JPH0338401Y2 (fr) * 1984-07-11 1991-08-14
JPH0372802B2 (fr) * 1986-09-24 1991-11-19 Eagle Ind Co Ltd
JPH0415361B2 (fr) * 1983-08-31 1992-03-17 Ngk Insulators Ltd

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2425175A1 (fr) * 1978-05-03 1979-11-30 Thomson Csf Composant hybride d'amplification en tres haute frequence et amplificateur comportant un tel composant

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143722Y2 (fr) * 1971-10-11 1976-10-23

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5979501U (ja) * 1982-11-18 1984-05-29 いすゞ自動車株式会社 排気タ−ビン過給機
JPH0415361B2 (fr) * 1983-08-31 1992-03-17 Ngk Insulators Ltd
JPH0338401Y2 (fr) * 1984-07-11 1991-08-14
JPH0372802B2 (fr) * 1986-09-24 1991-11-19 Eagle Ind Co Ltd

Also Published As

Publication number Publication date
JPS50151470A (fr) 1975-12-05

Similar Documents

Publication Publication Date Title
FR2264631B1 (fr)
FR2291803B1 (fr)
FI750358A (fr)
FR2286786B1 (fr)
FR2270917A1 (fr)
FR2275692B1 (fr)
FI753105A (fr)
FR2262522A1 (fr)
FR2270063B3 (fr)
FR2256132A1 (fr)
FR2284514B1 (fr)
AU495920B2 (fr)
IN143634B (fr)
HU168605B (fr)
FR2259346A1 (fr)
DE2434485A1 (fr)
DE2431176A1 (fr)
AU7138274A (fr)
AU7099174A (fr)
CH1357474A4 (fr)
AU481580A (fr)
DD110782A1 (fr)
CH589729A5 (fr)
CH575088A5 (fr)
DD121350A5 (fr)