JPS5729849B2 - - Google Patents
Info
- Publication number
- JPS5729849B2 JPS5729849B2 JP8934072A JP8934072A JPS5729849B2 JP S5729849 B2 JPS5729849 B2 JP S5729849B2 JP 8934072 A JP8934072 A JP 8934072A JP 8934072 A JP8934072 A JP 8934072A JP S5729849 B2 JPS5729849 B2 JP S5729849B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8934072A JPS5729849B2 (https=) | 1972-09-05 | 1972-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8934072A JPS5729849B2 (https=) | 1972-09-05 | 1972-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4946378A JPS4946378A (https=) | 1974-05-02 |
| JPS5729849B2 true JPS5729849B2 (https=) | 1982-06-25 |
Family
ID=13967950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8934072A Expired JPS5729849B2 (https=) | 1972-09-05 | 1972-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5729849B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5950512B2 (ja) * | 1974-12-24 | 1984-12-08 | 三菱樹脂株式会社 | 不銹鋼外観を有するプラスチツク積層金属板 |
| JPS5250385A (en) * | 1975-10-20 | 1977-04-22 | Yoshihito Tsumura | Process for producing coated metal plaes |
| JPS56110660U (https=) * | 1980-12-23 | 1981-08-27 | ||
| JPS59193039A (ja) * | 1983-04-15 | 1984-11-01 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| JP2748620B2 (ja) * | 1989-12-01 | 1998-05-13 | 富士通株式会社 | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4854869A (https=) * | 1971-11-09 | 1973-08-01 |
-
1972
- 1972-09-05 JP JP8934072A patent/JPS5729849B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4946378A (https=) | 1974-05-02 |