JPS5727141Y2 - - Google Patents
Info
- Publication number
- JPS5727141Y2 JPS5727141Y2 JP1976106641U JP10664176U JPS5727141Y2 JP S5727141 Y2 JPS5727141 Y2 JP S5727141Y2 JP 1976106641 U JP1976106641 U JP 1976106641U JP 10664176 U JP10664176 U JP 10664176U JP S5727141 Y2 JPS5727141 Y2 JP S5727141Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976106641U JPS5727141Y2 (tr) | 1976-08-09 | 1976-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976106641U JPS5727141Y2 (tr) | 1976-08-09 | 1976-08-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5324259U JPS5324259U (tr) | 1978-03-01 |
| JPS5727141Y2 true JPS5727141Y2 (tr) | 1982-06-14 |
Family
ID=28716728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976106641U Expired JPS5727141Y2 (tr) | 1976-08-09 | 1976-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5727141Y2 (tr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2705653B2 (ja) * | 1994-08-31 | 1998-01-28 | 日本電気株式会社 | 電子デバイス組立体およびその製造方法 |
| JP2705658B2 (ja) * | 1994-08-31 | 1998-01-28 | 日本電気株式会社 | 電子デバイス組立体およびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4868170A (tr) * | 1971-12-20 | 1973-09-17 | ||
| JPS50140063A (tr) * | 1974-04-25 | 1975-11-10 |
-
1976
- 1976-08-09 JP JP1976106641U patent/JPS5727141Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4868170A (tr) * | 1971-12-20 | 1973-09-17 | ||
| JPS50140063A (tr) * | 1974-04-25 | 1975-11-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5324259U (tr) | 1978-03-01 |