JPS5727141Y2 - - Google Patents

Info

Publication number
JPS5727141Y2
JPS5727141Y2 JP1976106641U JP10664176U JPS5727141Y2 JP S5727141 Y2 JPS5727141 Y2 JP S5727141Y2 JP 1976106641 U JP1976106641 U JP 1976106641U JP 10664176 U JP10664176 U JP 10664176U JP S5727141 Y2 JPS5727141 Y2 JP S5727141Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976106641U
Other languages
Japanese (ja)
Other versions
JPS5324259U (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976106641U priority Critical patent/JPS5727141Y2/ja
Publication of JPS5324259U publication Critical patent/JPS5324259U/ja
Application granted granted Critical
Publication of JPS5727141Y2 publication Critical patent/JPS5727141Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1976106641U 1976-08-09 1976-08-09 Expired JPS5727141Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976106641U JPS5727141Y2 (https=) 1976-08-09 1976-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976106641U JPS5727141Y2 (https=) 1976-08-09 1976-08-09

Publications (2)

Publication Number Publication Date
JPS5324259U JPS5324259U (https=) 1978-03-01
JPS5727141Y2 true JPS5727141Y2 (https=) 1982-06-14

Family

ID=28716728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976106641U Expired JPS5727141Y2 (https=) 1976-08-09 1976-08-09

Country Status (1)

Country Link
JP (1) JPS5727141Y2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2705653B2 (ja) * 1994-08-31 1998-01-28 日本電気株式会社 電子デバイス組立体およびその製造方法
JP2705658B2 (ja) * 1994-08-31 1998-01-28 日本電気株式会社 電子デバイス組立体およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4868170A (https=) * 1971-12-20 1973-09-17
JPS50140063A (https=) * 1974-04-25 1975-11-10

Also Published As

Publication number Publication date
JPS5324259U (https=) 1978-03-01

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