JPS5726853U - - Google Patents

Info

Publication number
JPS5726853U
JPS5726853U JP1980103445U JP10344580U JPS5726853U JP S5726853 U JPS5726853 U JP S5726853U JP 1980103445 U JP1980103445 U JP 1980103445U JP 10344580 U JP10344580 U JP 10344580U JP S5726853 U JPS5726853 U JP S5726853U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980103445U
Other languages
Japanese (ja)
Other versions
JPS6223088Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980103445U priority Critical patent/JPS6223088Y2/ja
Publication of JPS5726853U publication Critical patent/JPS5726853U/ja
Application granted granted Critical
Publication of JPS6223088Y2 publication Critical patent/JPS6223088Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1980103445U 1980-07-22 1980-07-22 Expired JPS6223088Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980103445U JPS6223088Y2 (enrdf_load_stackoverflow) 1980-07-22 1980-07-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980103445U JPS6223088Y2 (enrdf_load_stackoverflow) 1980-07-22 1980-07-22

Publications (2)

Publication Number Publication Date
JPS5726853U true JPS5726853U (enrdf_load_stackoverflow) 1982-02-12
JPS6223088Y2 JPS6223088Y2 (enrdf_load_stackoverflow) 1987-06-12

Family

ID=29464834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980103445U Expired JPS6223088Y2 (enrdf_load_stackoverflow) 1980-07-22 1980-07-22

Country Status (1)

Country Link
JP (1) JPS6223088Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158001A (ja) * 2005-12-05 2007-06-21 Nec Electronics Corp テープキャリアパッケージ及びそれを搭載した表示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158001A (ja) * 2005-12-05 2007-06-21 Nec Electronics Corp テープキャリアパッケージ及びそれを搭載した表示装置

Also Published As

Publication number Publication date
JPS6223088Y2 (enrdf_load_stackoverflow) 1987-06-12

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