JPS5726853U - - Google Patents
Info
- Publication number
- JPS5726853U JPS5726853U JP1980103445U JP10344580U JPS5726853U JP S5726853 U JPS5726853 U JP S5726853U JP 1980103445 U JP1980103445 U JP 1980103445U JP 10344580 U JP10344580 U JP 10344580U JP S5726853 U JPS5726853 U JP S5726853U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980103445U JPS6223088Y2 (enrdf_load_html_response) | 1980-07-22 | 1980-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980103445U JPS6223088Y2 (enrdf_load_html_response) | 1980-07-22 | 1980-07-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5726853U true JPS5726853U (enrdf_load_html_response) | 1982-02-12 |
| JPS6223088Y2 JPS6223088Y2 (enrdf_load_html_response) | 1987-06-12 |
Family
ID=29464834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980103445U Expired JPS6223088Y2 (enrdf_load_html_response) | 1980-07-22 | 1980-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6223088Y2 (enrdf_load_html_response) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007158001A (ja) * | 2005-12-05 | 2007-06-21 | Nec Electronics Corp | テープキャリアパッケージ及びそれを搭載した表示装置 |
-
1980
- 1980-07-22 JP JP1980103445U patent/JPS6223088Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007158001A (ja) * | 2005-12-05 | 2007-06-21 | Nec Electronics Corp | テープキャリアパッケージ及びそれを搭載した表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6223088Y2 (enrdf_load_html_response) | 1987-06-12 |