JPS5726410B2 - - Google Patents

Info

Publication number
JPS5726410B2
JPS5726410B2 JP10923476A JP10923476A JPS5726410B2 JP S5726410 B2 JPS5726410 B2 JP S5726410B2 JP 10923476 A JP10923476 A JP 10923476A JP 10923476 A JP10923476 A JP 10923476A JP S5726410 B2 JPS5726410 B2 JP S5726410B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10923476A
Other languages
Japanese (ja)
Other versions
JPS5334466A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10923476A priority Critical patent/JPS5334466A/ja
Publication of JPS5334466A publication Critical patent/JPS5334466A/ja
Publication of JPS5726410B2 publication Critical patent/JPS5726410B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)
JP10923476A 1976-09-10 1976-09-10 Electrode construction of semiconductor device Granted JPS5334466A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10923476A JPS5334466A (en) 1976-09-10 1976-09-10 Electrode construction of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10923476A JPS5334466A (en) 1976-09-10 1976-09-10 Electrode construction of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5334466A JPS5334466A (en) 1978-03-31
JPS5726410B2 true JPS5726410B2 (,) 1982-06-04

Family

ID=14505006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10923476A Granted JPS5334466A (en) 1976-09-10 1976-09-10 Electrode construction of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5334466A (,)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0652746B2 (ja) * 1985-06-18 1994-07-06 沖電気工業株式会社 半導体装置
JPH0526738Y2 (,) * 1985-07-20 1993-07-07
US6297562B1 (en) * 1999-09-20 2001-10-02 Telefonaktieboalget Lm Ericsson (Publ) Semiconductive chip having a bond pad located on an active device

Also Published As

Publication number Publication date
JPS5334466A (en) 1978-03-31

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