JPS5726200A - Plating device for printed wiring substrate - Google Patents
Plating device for printed wiring substrateInfo
- Publication number
- JPS5726200A JPS5726200A JP9878980A JP9878980A JPS5726200A JP S5726200 A JPS5726200 A JP S5726200A JP 9878980 A JP9878980 A JP 9878980A JP 9878980 A JP9878980 A JP 9878980A JP S5726200 A JPS5726200 A JP S5726200A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plating
- frame
- frames
- cells
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To perform plating automatically at prescribed current density, time and high performance by supplying electric power to every substrate conveying frame with frame number display pins immersed in plating cells from separate power sources and inputtng only the respective substrate surface areas to an area setter.
CONSTITUTION: In case when a number detector 3 is mounted to a substrate stocker 7, a conveying frame 1 is stopped before a frame number display pin 2 abuts on a detecting pin 3' and the operator mounts a substrate 9 to this. The detector 3 detects the intrinsic number of that frame and stores the same in a control device 5. The operator sets the square meter (m2) number of the substrate with an area setter 4, stores the same in the device 5, and checks with the setter 4. He performs this operation successively and holds a large number of the frames 9 to the sotcker 7. Thence, the frames 1 are treated in respective pretreatment cells A, and are immersed in any of plating cells B; at the same time, the device 5 sets power sources D at the electric current values conforming to the square meter numbers of said frames 9, whereby plating is accomplished.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9878980A JPS5726200A (en) | 1980-07-21 | 1980-07-21 | Plating device for printed wiring substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9878980A JPS5726200A (en) | 1980-07-21 | 1980-07-21 | Plating device for printed wiring substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5726200A true JPS5726200A (en) | 1982-02-12 |
Family
ID=14229129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9878980A Pending JPS5726200A (en) | 1980-07-21 | 1980-07-21 | Plating device for printed wiring substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5726200A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61275909A (en) * | 1985-05-30 | 1986-12-06 | Nosaka Denki Seisakusho:Kk | Work schedule generating method |
-
1980
- 1980-07-21 JP JP9878980A patent/JPS5726200A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61275909A (en) * | 1985-05-30 | 1986-12-06 | Nosaka Denki Seisakusho:Kk | Work schedule generating method |
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