JPS5725248Y2 - - Google Patents
Info
- Publication number
- JPS5725248Y2 JPS5725248Y2 JP1977004998U JP499877U JPS5725248Y2 JP S5725248 Y2 JPS5725248 Y2 JP S5725248Y2 JP 1977004998 U JP1977004998 U JP 1977004998U JP 499877 U JP499877 U JP 499877U JP S5725248 Y2 JPS5725248 Y2 JP S5725248Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977004998U JPS5725248Y2 (en) | 1977-01-18 | 1977-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977004998U JPS5725248Y2 (en) | 1977-01-18 | 1977-01-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53100887U JPS53100887U (en) | 1978-08-15 |
| JPS5725248Y2 true JPS5725248Y2 (en) | 1982-06-01 |
Family
ID=28691814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977004998U Expired JPS5725248Y2 (en) | 1977-01-18 | 1977-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5725248Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020056110A (en) * | 2014-06-12 | 2020-04-09 | アルファ・アセンブリー・ソリューションズ・インコーポレイテッドＡｌｐｈａ Ａｓｓｅｍｂｌｙ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． | Sinter material and adhesion method using the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5654091A (en) * | 1979-10-09 | 1981-05-13 | Suwa Seikosha Kk | Electric circuit unit |
-
1977
- 1977-01-18 JP JP1977004998U patent/JPS5725248Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020056110A (en) * | 2014-06-12 | 2020-04-09 | アルファ・アセンブリー・ソリューションズ・インコーポレイテッドＡｌｐｈａ Ａｓｓｅｍｂｌｙ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． | Sinter material and adhesion method using the same |
| JP2022062715A (en) * | 2014-06-12 | 2022-04-20 | アルファ・アセンブリー・ソリューションズ・インコーポレイテッド | Sintering materials and attachment methods using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53100887U (en) | 1978-08-15 |