JPS53100887U - - Google Patents
Info
- Publication number
- JPS53100887U JPS53100887U JP1977004998U JP499877U JPS53100887U JP S53100887 U JPS53100887 U JP S53100887U JP 1977004998 U JP1977004998 U JP 1977004998U JP 499877 U JP499877 U JP 499877U JP S53100887 U JPS53100887 U JP S53100887U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977004998U JPS5725248Y2 (en) | 1977-01-18 | 1977-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977004998U JPS5725248Y2 (en) | 1977-01-18 | 1977-01-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53100887U true JPS53100887U (en) | 1978-08-15 |
| JPS5725248Y2 JPS5725248Y2 (en) | 1982-06-01 |
Family
ID=28691814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977004998U Expired JPS5725248Y2 (en) | 1977-01-18 | 1977-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5725248Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5654091A (en) * | 1979-10-09 | 1981-05-13 | Suwa Seikosha Kk | Electric circuit unit |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017525839A (en) * | 2014-06-12 | 2017-09-07 | アルファ・アセンブリー・ソリューションズ・インコーポレイテッドＡｌｐｈａ Ａｓｓｅｍｂｌｙ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． | Sintered material and bonding method using the same |
-
1977
- 1977-01-18 JP JP1977004998U patent/JPS5725248Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5654091A (en) * | 1979-10-09 | 1981-05-13 | Suwa Seikosha Kk | Electric circuit unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5725248Y2 (en) | 1982-06-01 |