JPS5724658B2 - - Google Patents

Info

Publication number
JPS5724658B2
JPS5724658B2 JP1966876A JP1966876A JPS5724658B2 JP S5724658 B2 JPS5724658 B2 JP S5724658B2 JP 1966876 A JP1966876 A JP 1966876A JP 1966876 A JP1966876 A JP 1966876A JP S5724658 B2 JPS5724658 B2 JP S5724658B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1966876A
Other languages
Japanese (ja)
Other versions
JPS52102674A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1966876A priority Critical patent/JPS52102674A/ja
Publication of JPS52102674A publication Critical patent/JPS52102674A/ja
Publication of JPS5724658B2 publication Critical patent/JPS5724658B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP1966876A 1976-02-24 1976-02-24 Semiconductor device Granted JPS52102674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1966876A JPS52102674A (en) 1976-02-24 1976-02-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1966876A JPS52102674A (en) 1976-02-24 1976-02-24 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS52102674A JPS52102674A (en) 1977-08-29
JPS5724658B2 true JPS5724658B2 (ref) 1982-05-25

Family

ID=12005610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1966876A Granted JPS52102674A (en) 1976-02-24 1976-02-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS52102674A (ref)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519587A (en) * 1974-07-12 1976-01-26 Sharp Kk Handotaisochino seizoho

Also Published As

Publication number Publication date
JPS52102674A (en) 1977-08-29

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